UPD30121 NEC [NEC], UPD30121 Datasheet - Page 72

• Manufacturer Part Number: UPD30121
• Description: VR4121TM 64-/32-BIT MICROPROCESSOR
• Manufacturer: NEC [NEC]

4. RECOMMENDED SOLERING CONDITIONS
Technology Manual (C10535E).
representative.
72
PD30121F1-131-GA1: 224-pin plastic FBGA (16
PD30121F1-168-GA1: 224-pin plastic FBGA (16
Infrared reflow
VPS
Partial heating
The PD30121 should be soldered and mounted under the following recommended conditions.
For details of recommended soldering conditions, refer to the document Semiconductor Device Mounting
For soldering methods and conditions other than those recommended below, contact your NEC sales
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Soldering
Method
Package peak temperature: 230 C, Time: 30 seconds max. (at 210 C or
higher), Count: 2 times max., Exposure limit: 3 days
125 C for 10 to 72 hours.)
Package peak temperature: 215 C, Time: 25 to 40 seconds (at 200 C or
higher), Count: 2 times max. , Exposure limit: 3 days
125 C for 10 to 72 hours.)
Pin temperature: 300 C max., Time: 3 seconds max. (per pin row)
Table 4-1. Surface Mounting Type Soldering Conditions
Soldering Conditions
Data Sheet U14691EJ1V0DS00
16)
16)
Note
Note
(after that, prebake at
(after that, prebake at
Condition Symbol
Recommended
VP15-103-2
IR30-103-2
PD30121