mf1s7009 NXP Semiconductors, mf1s7009 Datasheet - Page 27

• Manufacturer Part Number: mf1s7009
• Description: Mainstream Contactless Smart Card Ic For Fast And Easy Solution Development
• Manufacturer: NXP Semiconductors

NXP Semiconductors
12. Limiting values
13. Characteristics
MF1S7009
Product data sheet
PUBLIC
Table 22.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
Table 23.
[1]
[2]
[3]
Symbol
I
P
T
T
V
I
Symbol
C
f
EEPROM characteristics
t
N
I
lu
i
ret
stg
amb
tot
ESD
i
endu(W)
/pack
Stresses above one or more of the limiting values may cause permanent damage to the device
Exposure to limiting values for extended periods may affect device reliability
MIL Standard 883-C method 3015; Human body model: C = 100 pF, R = 1.5 kΩ
Stresses above one or more of the values may cause permanent damage to the device.
Exposure to limiting values for extended periods may affect device reliability.
LCR meter, T
Limiting values
Characteristics
Parameter
input current
total power dissipation per package
storage temperature
ambient temperature
electrostatic discharge voltage
latch-up current
Parameter
input capacitance
input frequency
retention time
write endurance
amb
All information provided in this document is subject to legal disclaimers.
= 22 °C, f
Rev. 3 — 26 July 2010
i
[1][2]
[1][2]
= 13.56 MHz, 2.8 V RMS.
Conditions
T
T
193031
amb
amb
= 22 °C
= 22 °C
[3]
Mainstream contactless smart card IC
[3]
Min
15.0
-
10
100000
Min
-
-
−55
−25
2
±100
Typ
17.0
13.56
-
200000
MF1S7009
Max
30
+125
+70
-
-
200
© NXP B.V. 2010. All rights reserved.
Max
19.0
-
-
-
Unit
mA
mW
°C
°C
kV
mA
Unit
pF
MHz
year
cycle
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