mf1s7009 NXP Semiconductors, mf1s7009 Datasheet - Page 2
mf1s7009
Manufacturer Part Number
mf1s7009
Description
Mainstream Contactless Smart Card Ic For Fast And Easy Solution Development
Manufacturer
NXP Semiconductors
Datasheet
1.MF1S7009.pdf
(34 pages)
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NXP Semiconductors
2. Features and benefits
MF1S7009
Product data sheet
PUBLIC
1.4 Security
1.5 Delivery options
2.1 MIFARE‚ RF Interface (ISO/IEC 14443 A)
2.2 EEPROM
•
•
•
•
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Contactless transmission of data and supply energy (no battery needed)
Operating distance up to 100 mm depending on antenna geometry and reader
configuration
Operating frequency of 13.56 MHz
Data transfer of 106 kbit/s
Data integrity of 16-bit CRC, parity, bit coding, bit counting
Anticollision
Typical ticketing transaction time of < 100 ms (including backup management)
4 kB, organized in 32 sectors with 4 blocks and 8 sectors with 16 blocks (one block
consists of 16 bytes)
User definable access conditions for each memory block
Data retention of 10 years.
Write endurance 100.000 cycles
Unique identifier for each device using double size UID (7 byte UID)
Mutual three pass authentication (ISO/IEC 9798-2)
Individual set of two keys per sector (per application) to support multi-application with
key hierarchy
Bumped die on wafer
MOA4 contactless module
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 26 July 2010
193031
Mainstream contactless smart card IC
MF1S7009
© NXP B.V. 2010. All rights reserved.
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