mf1s7009 NXP Semiconductors, mf1s7009 Datasheet - Page 18
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mf1s7009
Manufacturer Part Number
mf1s7009
Description
Mainstream Contactless Smart Card Ic For Fast And Easy Solution Development
Manufacturer
NXP Semiconductors
Datasheet
1.MF1S7009.pdf
(34 pages)
NXP Semiconductors
MF1S7009
Product data sheet
PUBLIC
10.3 MIFARE ACK and NAK
All timing can be measured according to ISO/IEC 14443-3 frame specification as shown
for the Frame Delay Time in
FDTPCD2PICC = Frame delay time PCD to PICC.
FDTPICC2PCD = Frame delay time PICC to PCD (must be at least 87 μS).
Remark: Due to the coding of commands, the measured timings usually exclude (a part
of) the end of communication. This needs to be considered, when comparing the given
times with the measured ones.
The MIFARE Classic uses a 4 bit ACK / NAK as shown in
Table 9.
Code (4-bit)
Ah
0h to 9h
Bh to Fh
Fig 11. Frame Delay Time (from PCD to PICC), and T
(1) Measurement of the FDT (Frame Delay Time) from PCD to PICC
MIFARE ACK and NAK
Last data bit transmitted by PCD
All information provided in this document is subject to legal disclaimers.
logic ''1''
logic ''0''
128/fc
128/fc
ACK/NAK
Acknowledge (ACK)
NAK
NAK
Rev. 3 — 26 July 2010
End of communication (E)
End of communication (E)
Figure
193031
256/fc
256/fc
11. For more details refer to
FDT = (n* 128 + 84)/fc
FDT = (n* 128 + 20)/fc
Mainstream contactless smart card IC
T
ACK
ACK
, T
NAK
and T
Table
First modulation of PICC
NAK
communication (S)
communication (S)
Ref. 3
9.
Start of
Start of
MF1S7009
128/fc
128/fc
and
© NXP B.V. 2010. All rights reserved.
001aam208
Ref.
4.
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