hx6136 Honeywell International's Solid State Electronics Center (SSEC), hx6136 Datasheet - Page 15

• Manufacturer Part Number: hx6136
• Description: First-in First-out Memory
• Manufacturer: Honeywell International's Solid State Electronics Center (SSEC)

Package Drawing for 6136 (22018696-001)
FIFO – HX6409/HX6218/HX6136
ORDERING INFORMATION
ORDERING INFORMATION
Find out more
For more information about Honeywell’s family of radiation hardened products and technology, visit
www.honeywell.com/radhard.
Honeywell reserves the right to make changes to any products or technology herein to improve reliability, function or design. Honeywell does not assume any liability
arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others.
Honeywell
12001 Highway 55
Plymouth, MN 55441
1-800-323-8295
www.honeywell.com/radhard
www.honeywell.com/radhard
H=Honeywell
(1) Orders may be faxed to 763-954-2051. Please contact our Customer Service Department at 763-954-2888 for
(2) Engineering Device description: Parameters are tested from -55 to 125˚ C, 24 hr burn-in, no radiation
Source
further information.
guaranteed. Contact Factory with other needs.
H
Process
X=SOI
X
PART NUMBER
6218 = 2K X 18
6136 = 1K X 36
6409 = 4K X 9
6409
PACKAGE DESIGN
F=132-Lead CQFP
D=68-Lead CQFP
T=32-Lead CQFP
D
Form #900157
November 2006
©2006 Honeywell International Inc.
E=Engr Device (2)
SCREEN LEVEL
B=Level B
S=Level S
S
N=No Level Guaranteed
R=1X10
H=1x10
F=3x10
TOTAL DOSE
HARDNESS
5
6
5
H
rad(Si02)
rad(Si02)
rad(Si02)
C=CMOS Level
BUFFER TYPE
T=TTL Level
INPUT
C
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