ml70q5110la Oki Semiconductor, ml70q5110la Datasheet - Page 24

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ml70q5110la

Manufacturer Part Number
ml70q5110la
Description
Bluetooth Baseband Controller Ic
Manufacturer
Oki Semiconductor
Datasheet
PACKAGE DIMENSIONS
Caution regarding the installation of surface mounted type packages:
Surface mounted type packages are very susceptible to heat during reflow mounting and package moisture content
when in storage. Therefore, please contact your Oki Electric Industry Co., Ltd. sales representative when
considering reflow experiments and let us know the product name, package name, pin count, package code, the
desired mounting conditions (reflow method, temperature, count), storage conditions, etc.
OKI Semiconductor
P-LFBGA144-1111-0.80
5
24/26
Package material
Ball material
Package weight (g)
Rev. No./Last Revised
Epoxy resin
Sn/Pb
0.3 TYP.
1/Aug.25,1999
FEDL70Q5110LA-01
ML70Q5110LA
(Unit: mm)

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