ltm4601ahv Linear Technology Corporation, ltm4601ahv Datasheet - Page 19

• Manufacturer Part Number: ltm4601ahv
• Description: 12a, 28vin Dc/dc ?module With Pll, Output Tracking And Margining
• Manufacturer: Linear Technology Corporation

APPLICATIONS INFORMATION
to 25°C inside the μModule with a thermal resistance θ
from junction to case between 6°C/W to 9°C/W. This will
maintain the maximum junction temperature inside the
μModule below 125°C.
Safety Considerations
The LTM4601AHV modules do not provide isolation
from V
a slow blow fuse with a rating twice the maximum input
current needs to be provided to protect each unit from
catastrophic failure.
Layout Checklist/Example
The high integration of LTM4601AHV makes the PCB
board layout very simple and easy. However, to optimize
its electrical and thermal performance, some layout con-
siderations are still necessary.
• Use large PCB copper areas for high current path, in-
cluding V
PCB conduction loss and thermal stress.
IN
to V
IN
OUT
, PGND and V
. There is no internal fuse. If required,
OUT
. It helps to minimize the
PGND
V
V
OUT
IN
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C
OUT
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C
IN
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C
• • •
OUT
C
Figure 17. Recommended Layout
IN
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JC
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• Place high frequency ceramic input and output capaci-
• Place a dedicated power ground layer underneath the
• To minimize the via conduction loss and reduce module
• Do not put vias directly on pads unless they are
• Use a separated SGND ground copper area for com-
Figure 17 gives a good example of the recommended
layout.
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tors next to the V
high frequency noise.
unit. Refer frequency synchronization source to power
ground.
thermal stress, use multiple vias for interconnection
between top layer and other power layers.
capped.
ponents connected to signal pins. Connect the SGND
to PGND underneath the unit.
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CONTROL
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4601AHV F17
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CONTROL
SIGNAL
GND
CONTROL
IN
, PGND and V
LTM4601AHV
OUT
pins to minimize
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4601ahvf