ssm6n35fe TOSHIBA Semiconductor CORPORATION, ssm6n35fe Datasheet
ssm6n35fe
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ssm6n35fe Summary of contents
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... D °C T 150 ch −55 to 150 °C T stg and the significant change 2 × 6) Equivalent Circuit (top view SSM6N35FE 1.6±0.05 1.2±0. 4.Source2 1.Source1 V 5.Gate2 2.Gate1 6.Drain1 ES6 3.Drain2 JEDEC - JEITA - TOSHIBA 2-2N1A Weight: 3.0 mg (typ.) in 2008-03-10 Unit ...
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... Ta = 25°C Usage Considerations Let V be the voltage applied between gate and source that causes the drain current (I th SSM6N35FE). Then, for normal switching operation This relationship can be expressed as: V th. Take this into consideration when using the device. Handling Precaution When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is protected against electrostatic discharge ...
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... Gate–source voltage V 10 Common Source −50 1000 Ambient temperature Ta (°C) 3 SSM6N35FE I – −25° ( – (ON) GS Common Source 25° 100°C − ...
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... Drain–source voltage V 250 Mounted on a FR4 board. (25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 0.135 mm 200 150 100 50 0 1000 Total Rating Ambient temperature Ta (°C) 4 SSM6N35FE ⎪Y ⎪ – Common Source 25°C 10 100 1000 Drain current I (mA – V ...
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... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 5 SSM6N35FE 20070701-EN GENERAL 2008-03-10 ...