ncp3030a ON Semiconductor, ncp3030a Datasheet - Page 3

• Manufacturer Part Number: ncp3030a
• Description: Ncp3030a, Ncp3030b Synchronous Pwm Controller
• Manufacturer: ON Semiconductor

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The maximum package power dissipation limit must not be exceeded.
2. When mounted on minimum recommended FR−4 or G−10 board.
3. The value of qJA is measured with the device mounted on minimum footprint, in still air environment with T
4. 60−180 seconds minimum above 237°C.
ABSOLUTE MAXIMUM RATINGS
P
High Side Drive Boost Pin
Boost to V
COMP
Feedback
High−Side Driver Output
Low−Side Driver Output
Main Supply Voltage Input
Switch Node Voltage
Maximum Average Current
Operating Junction Temperature Range (Note 1)
Maximum Junction Temperature
Storage Temperature Range
Thermal Characteristics − SOIC−8 Plastic Package (Note 2)
Lead Temperature Soldering (10 sec): Reflow (SMD styles only) Pb−Free
(Note 4)
application depends on the user’s specific board design.
D
+
T
J(max)
V
Thermal Resistance Junction−to−Air (Note 3)
SW
R
CC
qJA
differential voltage
, BST, HSDRV, LSDRV, V
* T
A
Rating
(measured vs. GND pin 8, unless otherwise noted)
SW
, GND
http://onsemi.com
3
BST−V
Symbol
T
COMP
HSDR
LSDR
J(MAX)
R
V
BST
V
I
T
FB
max
R
T
SW
qJA
CC
stg
J
F
SW
V
13.2
13.2
5.5
5.5
MAX
45
40
40
40
A
−40 to +140
−55 to +150
260 Peak
= 25°C. The value in any given
+150
130
165
110
V
−0.3
−0.3
−0.3
−0.3
−0.3
−0.3
−0.3
−0.6
MIN
°C/W
Unit
mA
°C
°C
°C
°C
V
V
V
V
V
V
V
V