w83627ehf Winbond Electronics Corp America, w83627ehf Datasheet - Page 6

• Manufacturer Part Number: w83627ehf
• Description: W83627ehf/ef W83627ehg/eg Winbond Lpc I/o
• Manufacturer: Winbond Electronics Corp America

7.
8.
9.
10.
CONFIGURATION REGISTER ................................................................................................... 91
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10 Logical Device 9 (GPIO2,GPIO3, GPIO4, GPIO5 & SUSLED) (VSB Power) ................. 110
7.11 Logical Device A (ACPI) .................................................................................................. 114
7.12 Logical Device B (Hardware Monitor, for W83627EHF/EHG only) ................................. 121
SPECIFICATIONS..................................................................................................................... 122
8.1
8.2
8.3
HOW TO READ THE TOP MARKING ...................................................................................... 134
PACKAGE SPECIFICATION..................................................................................................... 135
6.8.79
6.8.80
6.8.81
6.8.82
6.8.83
6.8.84
6.8.85
6.8.86
6.8.87
6.8.88
6.8.89
6.8.90
6.8.91
6.8.92
6.8.93
6.8.94
Chip (Global) Control Register........................................................................................... 91
Logical Device 0 (FDC)...................................................................................................... 97
Logical Device 1 (Parallel Port) ....................................................................................... 101
Logical Device 2 (UART A) .............................................................................................. 102
Logical Device 3 (UART B) .............................................................................................. 103
Logical Device 5 (Keyboard Controller) ........................................................................... 105
Logical Device 6 (Serial Flash Interface) ......................................................................... 106
Logical Device 7 (GPIO1, GPIO6, Game Port & MIDI Port)............................................ 106
Logical Device 8 (WDTO# & PLED) ................................................................................ 109
Absolute Maximum Ratings ............................................................................................. 122
DC CHARACTERISTICS................................................................................................. 122
AC CHARACTERISTICS ................................................................................................. 130
8.3.1
8.3.2
AUXTIN Temperature Sensor Over-temperature (High Byte) Register - Index 55h (Bank 2)
83
AUXTIN Temperature Sensor Over-temperature(Low Byte) Register - Index 56h (Bank 2)
84
Interrupt Status Register 3 - Index 50h (Bank 4) ................................................................84
SMI# Mask Register 4 - Index 51h (Bank 4).......................................................................85
Reserved Register - Index 52h (Bank 4) ............................................................................85
BEEP Control Register 3 - Index 53h (Bank 4)...................................................................85
SYSTIN Temperature Sensor Offset Register - Index 54h (Bank 4) ..................................86
CPUTIN Temperature Sensor Offset Register - Index 55h (Bank 4) ..................................86
AUXTIN Temperature Sensor Offset Register - Index 56h (Bank 4) ..................................87
Reserved Register - Index 57h-58h (Bank 4) .....................................................................87
Real Time Hardware Status Register I - Index 59h (Bank 4)..............................................87
Real Time Hardware Status Register II - Index 5Ah (Bank 4) ............................................88
Real Time Hardware Status Register III - Index 5Bh (Bank 4) ...........................................89
Reserved Register - Index 5Ch-5Dh (Bank 4) ....................................................................89
Value RAM 2  Index 50h-59h (Bank 5) ...........................................................................89
Winbond Test Register - Index 50h-57h (Bank 6) ..............................................................90
Power On / Off Timing ......................................................................................................130
AC Power Failure Resume Timing ...................................................................................131
W83627EHF/EF, W83627EHG/EG
-V-
Publication Release Date: January 18, 2006
Revision 1.0