mpc5566 Freescale Semiconductor, Inc, mpc5566 Datasheet - Page 5

• Manufacturer Part Number: mpc5566
• Description: Mpc5566 High Performance Microcontroller
• Manufacturer: Freescale Semiconductor, Inc

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3.2
The shaded rows in the following table indicate information specific to a four-layer board.
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Freescale Semiconductor
Spec
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29
Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings only,
and functional operation at the maxima is not guaranteed. Stress beyond any of the listed maxima can affect device reliability
or cause permanent damage to the device.
1.5 V ± 10% for proper operation. This parameter is specified at a maximum junction temperature of 150
All functional non-supply I/O pins are clamped to V
AC signal overshoot and undershoot of up to ± 2.0 V of the input voltages is permitted for an accumulative duration of
60 hours over the complete lifetime of the device (injection current not limited for this duration).
Internal structures hold the voltage greater than –1.0 V if the injection current limit of 2 mA is met. Keep the negative DC
voltage greater than –0.6 V on eTPUB[15] and SINB during the internal power-on reset (POR) state.
Internal structures hold the input voltage less than the maximum voltage on all pads powered by V
maximum injection current specification is met (2 mA for all pins) and V
Internal structures hold the input voltage less than the maximum voltage on all pads powered by V
injection current specification is met (2 mA for all pins) and V
Total injection current for all pins (including both digital and analog) must not exceed 25 mA.
Total injection current for all analog input pins must not exceed 15 mA.
Lifetime operation at these specification limits is not guaranteed.
Moisture sensitivity profile per IPC/JEDEC J-STD-020D.
Moisture sensitivity per JEDEC test method A112.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other board components, and board thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
Spec
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Maximum solder temperature
Moisture sensitivity level
Lead free (Pb-free)
Leaded (SnPb)
Thermal Characteristics
Junction to ambient, natural convection (one-layer board)
Junction to ambient, natural convection (four-layer board 2s2p)
Junction to ambient (@200 ft./min., one-layer board)
Junction to ambient (@200 ft./min., four-layer board 2s2p)
Junction to board (four-layer board 2s2p)
Junction to case
Junction to package top, natural convection
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MPC5566 Thermal Characteristic
Characteristic
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Table 2. Absolute Maximum Ratings
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Table 3. MPC5566 Thermal Characteristics
MPC5566 Microcontroller Data Sheet, Rev. 2.0
SS
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6
and V
DDE
DDE
, or V
is within the operating voltage specifications.
1, 2
DDEH
DDEH
1, 3
Symbol
.
1
T
MSL
SDR
is within the operating voltage specifications.
(continued)
Symbol
R
R
R
R
R
R
Ψ
θJMA
θJMA
θJC
θJA
θJA
θJB
JT
Min
—
—
—
DDE
Electrical Characteristics
416 PBGA
DDEH
supplies, if the maximum
24
16
18
13
8
6
2
supplies, if the
o
260.0
245.0
C.
Max
3
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
o
C
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