adf4001 Analog Devices, Inc., adf4001 Datasheet - Page 3

• Manufacturer Part Number: adf4001
• Description: 200 Mhz Clock Generator Pll
• Manufacturer: Analog Devices, Inc.

Model
ADF4001BRU
ADF4001BRU-REEL
ADF4001BRU-REEL7
ADF4001BCP
ADF4001BCP-REEL
ADF4001BCP-REEL7
EVAL-ADF4001EB2
*Contact factory for chip availability.
TIMING CHARACTERISTICS
Parameter
t
t
t
t
t
t
Guaranteed by design but not production tested.
Specifications subject to change without notice.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADF4001 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
REV. A
R
ABSOLUTE MAXIMUM RATINGS
(
AV
AV
V
V
Digital I/O Voltage to GND . . . . . . . . . –0.3 V to V
Analog I/O Voltage to GND . . . . . . . . . . –0.3 V to V
REF
RF
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . 150°C
1
2
3
4
5
6
T
SET
P
P
A
Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C
IN
DD
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
to AV
= 25°C, unless otherwise noted.)
= 4.7 k ; T
IN
A to RF
to GND
to DV
, RF
DD
IN
DD
A, RF
IN
. . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.5 V
3
B . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 320 mV
A
= T
. . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
. . . . . . . . . . . . . . . . . . . . . . . . . 0 V to +0.3 V
IN
MIN
B to GND . . . . . . . –0.3 V to V
to T
MAX
CLOCK
, unless otherwise noted; dBm referred to 50
DATA
LE
LE
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Limit at
T
(B Version)
10
10
25
25
10
20
MIN
(MSB)
DB20
1, 2
to T
(AV
MAX
DD
= DV
t
1
DB19
DD
Figure 1. Timing Diagram
= 3 V
DD
DD
t
2
P
ORDERING GUIDE
+ 0.3 V
+ 0.3 V
+ 0.3 V
Package Description
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Lead Frame Chip Scale Package (LFCSP)*
Lead Frame Chip Scale Package (LFCSP)*
Lead Frame Chip Scale Package (LFCSP)*
Evaluation Board
10%, 5 V
DB2
Unit
ns min
ns min
ns min
ns min
ns min
ns min
–3–
t
3
TSSOP θ
LFCSP θ
LFCSP θ
Lead Temperature, Soldering
NOTES
1
2
3
Stresses above those listed under Absolute Maximum Ratings may cause perma-
This device is a high performance RF integrated circuit with an ESD rating of
GND = AGND = DGND = 0 V.
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
<2 kΩ and it is ESD sensitive. Proper precautions should be taken for handling and
assembly.
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
t
4
(CONTROL BIT C2)
10%; AV
.)
DB1
JA
JA
JA
Thermal Impedance (Paddle Not Soldered) 216°C/W
Thermal Impedance (Paddle Soldered) . . 122°C/W
DD
Thermal Impedance . . . . . . . . . . . . . . 150.4°C/W
≤ V
P
(CONTROL BIT C1)
≤ 6.0 V ; AGND = DGND = CPGND= 0 V;
DB0 (LSB)
Test Conditions/Comments
DATA to CLOCK Setup Time
DATA to CLOCK Hold Time
CLOCK High Duration
CLOCK Low Duration
CLOCK to LE Setup Time
LE Pulsewidth
t
5
t
6
WARNING!
ESD SENSITIVE DEVICE
Package Option
RU-16
RU-16
RU-16
CP-20
CP-20
CP-20
ADF4001