BLT52 Philips Semiconductors, BLT52 Datasheet - Page 8

• Manufacturer Part Number: BLT52
• Description: UHF power transistor
• Manufacturer: Philips Semiconductors

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Philips Semiconductors
MOUNTING RECOMMENDATIONS
Both the metallized groundplate and leads contribute to the heatflow. It is recommended that the transistor is mounted
on a grounded metallized area of a maximum thickness of 0.8 mm on the printed-circuit board, equipped with at least 12
(0.5 mm diameter) through metallized holes filled with solder.
A thermal resistance R
on the printed-circuit board.
1998 Jan 28
UHF power transistor
Dimensions in mm.
th(mb-h)
of 5 K/W can be achieved if heatsink compound is applied when the transistor is mounted
7.38
Fig.15 Reflow soldering footprint for SOT409A.
3.60
1.87 (2 )
4.60
8
1.00 (9 )
0.60 (4 )
MGK390
0.80 (2 )
1.00 (8 )
0.50 (12 )
Product specification
BLT52