MPC8248 Freescale Semiconductor, Inc, MPC8248 Datasheet - Page 54

• Manufacturer Part Number: MPC8248
• Description: Mpc8248 Powerquicc Ii Integrated Communications Processor
• Manufacturer: Freescale Semiconductor, Inc

Package
9
Figure 13
Table 21
nomenclature of the 516 PBGA package.
54
Package
Plated substrate via
provides package parameters.
shows the side profile of the PBGA package.
1 mm pitch
VR, ZQ
Code
In the VR package, sphere composition is lead-free (refer to
requires higher temperature reflow than what is required for other
PowerQUICC II packages. Users should consult “Freescale
PowerQUICC II™ Pb-Free Packaging Information”
(MPC8250PBFREEPKG) available at www.freescale.com.
Transfer molding compound
MPC8272 PowerQUICC II™ Family Hardware Specifications, Rev. 1.5
Figure 13. Side View of the PBGA Package Remove
PBGA
Type
NOTE: Temperature Reflow for the VR Package
Table 21. Package Parameters
Figure 14
27 x 27
Outline
(mm)
attach
Die
provides the mechanical dimensions and bottom surface
DIE
Interconnects
Ball bond
Wire bonds
516
Pitch
(mm)
1
Table
Nominal Unmounted
Height (mm)
2). This
Screen-printed
solder mask
Cu substrate traces
Resin glass epoxy
2.25
Freescale Semiconductor