MPC8248 Freescale Semiconductor, Inc, MPC8248 Datasheet - Page 14

• Manufacturer Part Number: MPC8248
• Description: Mpc8248 Powerquicc Ii Integrated Communications Processor
• Manufacturer: Freescale Semiconductor, Inc

Power Dissipation
4.7
5
Table 7
thermal management is required to ensure the junction temperature does not exceed the maximum
specified value. Also note that the I/O power should be included when determining whether to use a heat
sink. For a complete list of possible clock configurations, refer to
Modes.”
14
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MIL-SPEC and EIA/JESD (JEDEC) Specifications
(Available from Global Engineering Documents)
JEDEC Specifications
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an
2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance
1
2
3
66.7 MHz = 0.35 W (nominal), 0.4 W (maximum)
83.3 MHz = 0.4 W (nominal), 0.5 W (maximum)
100 MHz = 0.5 W (nominal), 0.6 W (maximum)
133 MHz = 0.7 W (nominal), 0.8 W (maximum)
Test temperature = 105
P
Values do not include I/O. Add the following estimates for active I/O based on the following bus speeds:
Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp.
212–220.
Power Dissipation
INT
provides preliminary, estimated power dissipation for various configurations. Note that suitable
References
= I
(MHz)
66.67
Bus
100
100
133
DD
x V
DD
Table 7. Estimated Power Dissipation for Various Configurations
Watts
MPC8272 PowerQUICC II™ Family Hardware Specifications, Rev. 1.5
Multiplication
°
C
Factor
CPM
3
2
2
2
(MHz)
CPM
200
200
200
267
Multiplication
Factor
CPU
4
3
4
3
Section 7, “Clock Configuration
(MHz)
CPU
266
300
400
400
[phone]
800-854-7179 or
303-397-7956
http://www.jedec.org
Nominal
1.1
1.3
1.5
1
Vddl 1.5 Volts
Freescale Semiconductor
1
P
INT
(W)
Maximum
2, 3
1.2
1.3
1.5
1.8