ESD3V3U4ULC Infineon Technologies, ESD3V3U4ULC Datasheet - Page 7

• Manufacturer Part Number: ESD3V3U4ULC
• Manufacturer: Infineon Technologies

Specifications of ESD3V3U4ULC

• Packages: TSLP-9-1
• Vesd(min)(iec61000-4-2 Contact): 25.0 kV
• Vrwm: 3.3 V
• Ct @ F=1mhz: 0.5 pF
• Ir (typ): 10.0 nA
• Vbr (min): 4.0 V

1
1.1
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1.2
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2
Figure 1
Table 1
Type
ESD3V3U4ULC
Final Data Sheet
ESD / transient protection of high speed data lines exceeding :
– IEC61000-4-2 (ESD) : ±20 kV (air/contact)
– IEC61000-4-4 (EFT) : 2.5 kV (5/50ns)
– IEC61000-4-5 (Surge) : 3 A (8/20μs)
Maximum working voltage:
Ultra low capacitance
Very low clamping voltage:
Very low dynamic resistance:
TSLP-9-1 package with pad pitch 0.5 mm, optimized pad design to simplify PCB layout
Pb-free and halogen free package (RoHS compliant)
USB 3.0, 10/100/1000 Ethernet, Firewire
DVI, HDMI, S-ATA, DisplayPort
Mobile HDMI Link, MDDI, MIPI, etc.
Pin 1
Pin 9
a) Pin configuration
Ultra-low Capacitance ESD / Transient Protection Array
Features
Application Examples
Product Description
Ordering Information
Pin Configuration and Schematic Diagram
Pin 2
Pin 8
Package
PG-TSLP-9-1
C
L
Pin 3
= 0.4 pF I/O to GND (typical)
V
V
RWM
CL
R
DYN
= 8 V at
= 3.3 V
= 0.19 Ω (typical)
Pin 4
Pin 7
Configuration
4 lines, uni-directional
I
PP
= 16 A (typical)
Pin 5
Pin 6
Ultra-low Capacitance ESD / Transient Protection Array
7
I/O
Pin 1
b) Schematic diagram
I/O
Pin 2
Revision 1.0, 2012-01-10
Pin 3
I/O
GND
ESD3V3U4ULC
Pin 4
Marking code
I/O
Z2
Pin 5