TLE84110EL Infineon Technologies, TLE84110EL Datasheet - Page 10

• Manufacturer Part Number: TLE84110EL
• Manufacturer: Infineon Technologies

Specifications of TLE84110EL

• Packages: PG-SSOP-24
• Ipeak: 10 x 0.8
• Inhibit: y
• Iq (typ): 2.0 µA
• Mounting: SMIT
• Technology: BCD

4.3
Pos.
4.3.1
4.3.2
4.3.3
4.3.4
4.3.5
4.3.6
4.3.7
4.3.8
4.3.9
4.3.10
1) Not subject to production test, specified by design.
2) Specified RthJA value is according to JEDEC JESD51-2,-3 at natural convection on FR4 1s0p board; The Product
3) Specified RthJA value is according to JEDEC JESD51-2,-3 at natural convection on FR4 1s0p board; The Product
4) Specified RthJA value is according to JEDEC JESD51-2,-3 at natural convection on FR4 1s0p board; The Product
5) Specified RthJA value is according to JEDEC JESD51-2,-3 at natural convection on FR4 2s2p board; The Product
Data Sheet
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with minimal footprint copper area and 35 µm thickness.
Ta = -40°C, Ch 1 to Ch 10 are dissipating a total of 2.5W (0.25W each). Ta = 85°C, Ch 1 to Ch 10 are dissipating a total
of 1.8W (0.18W each).
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with additional cooling of 300 mm2 copper area and 35
µm thickness. Ta = -40°C, Ch 1 to Ch 10 are dissipating a total of 2.5W (0.25W each). Ta = 85°C, Ch 1 to Ch 10 are
dissipating a total of 1.8W (0.18W each).
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with additional cooling of 600 mm2 copper area and 35
µm thickness. Ta = -40°C, Ch 1 to Ch 10 are dissipating a total of 2.5W (0.25W each). Ta = 85°C, Ch 1 to Ch 10 are
dissipating a total of 1.8W (0.18W each).
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (4 x 35µm Cu). Ta = -40°C,
Ch 1 to Ch 10 are dissipating a total of 2.5W (0.25W each). Ta = 85°C, Ch 1 to Ch 10 are dissipating a total of 1.8W (0.18W
each).
Parameter
Junction to Case, Ta = -40 C
Junction to Case, Ta = 85 C
Junction to Ambient, Ta = -40 C
(1s0p, minimal footprint)
Junction to Ambient, Ta = 85 C
(1s0p, minimal footprint)
Junction to Ambient, Ta = -40 C
(1s0p, 300mm2 Cu)
Junction to Ambient, Ta = 85 C
(1s0p, 300mm2 Cu)
Junction to Ambient, Ta = -40 C
(1s0p, 600mm2 Cu)
Junction to Ambient, Ta = 85 C
(1s0p, 600mm2 Cu)
Junction to Ambient, Ta = -40 C
(2s2p)
Junction to Ambient, Ta = 85 C
(2s2p)
Thermal Resistance
Symbol
R
R
R
R
R
R
R
R
R
R
thjC_cold
thjC_hot
thjA_cold_min
thjA_hot_min
thjA_cold_300
thjA_hot_300
thjA_cold_600
thjA_hot_600
thjA_cold_2s2p
thjA_hot_2s2p
10
Min.
–
–
–
–
–
–
–
–
–
–
Limit Values
Typ.
3
4
114
96
69
56
62
50
35
30
Max.
–
–
–
–
–
–
–
–
–
–
General Product Characteristics
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
Unit
Deci Half Bridge IC
Rev. 1.0, 2010-04-27
Conditions
1)
1)
1) 2)
1) 2)
1) 3)
1) 3)
1) 4)
1) 4)
1) 5)
1) 5)
TLE84110EL