PMDPB65UP NXP Semiconductors, PMDPB65UP Datasheet - Page 10
PMDPB65UP
Manufacturer Part Number
PMDPB65UP
Description
Dual small-signal P-channel enhancement mode Field-Effect Transistor (FET) in a small and leadless ultra thin SOT1118 Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology
Manufacturer
NXP Semiconductors
Datasheet
1.PMDPB65UP.pdf
(15 pages)
NXP Semiconductors
8. Package outline
Fig 17. Package outline SOT1118 (HUSON6)
PMDPB65UP
Product data sheet
HUSON6: plastic, thermal enhanced ultra thin small outline package; no leads;
6 terminals; body 2 x 2 x 0.65 mm
Dimensions
Note
1. Dimension including plating thickness.
mm
SOT1118
Unit
Outline
version
max
nom
min
0.65 0.04
A
(1)
terminal 1
index area
A
1
terminal 1
index area
L
E
0.35
0.25
p
1
b
IEC
p
2.1
1.9
D
1
6
0.77
0.57
D
1
e
e
1
2.1
1.9
JEDEC
E
D
All information provided in this document is subject to legal disclaimers.
- - -
1.1
0.9
0
E
1
References
D
b
1
3
4
p
0.65
Rev. 2 — 8 March 2011
e
0.54
0.44
e
v
1
JEITA
B
scale
0.3
0.2
L
A
1
p
A
E
B
0.1
v
0.05
A
y
20 V, 3.5 A dual P-channel Trench MOSFET
A
1
0.05
y
1
y
(8×)
1
2 mm
C
detail X
European
projection
PMDPB65UP
C
X
y
© NXP B.V. 2011. All rights reserved.
Issue date
10-08-03
10-08-16
sot1118_po
SOT1118
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