AD9148 Analog Devices, AD9148 Datasheet - Page 9

• Manufacturer Part Number: AD9148
• Manufacturer: Analog Devices

Specifications of AD9148

• Resolution (bits): 16bit
• Dac Update Rate: 1GSPS
• Dac Settling Time: n/a
• Max Pos Supply (v): +3.47V
• Single-supply: No
• Dac Type: Current Out
• Dac Input Format: LVDS,Par

Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
AVDD33, IOVDD
DVDD18, CVDD18
AGND
DGND
CGND
I120, VREF
IOUT1_P, IOUT1_N,
IOUT2_P, IOUT2_N,
IOUT3_P, IOUT3_N,
IOUT4_P, IOUT4_N
A15_P to A0_P,
A15_N to A0_N,
B15_P to B0_P,
B15_N, B0_N
DCIA_P, DCIA_N,
FRAMEA_P, FRAMEA_N,
DCIB_P, DCIB_N,
FRAMEB_P, FRAMEB_N
CLK_P, CLK_N,
REFCLK_P, REFCLK_N
CSB, SCLK, SDIO, SDO,
TDO, TDI, TCK, TMS,
RESET, IRQ, PLL_LOCK
Junction Temperature
Storage Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Typical θ
still air for each package offering. Airflow increases heat dissipation
effectively reducing θ
Range
JA
, θ
JB
, and θ
JC
JA
are specified vs. the number of PCB layers in
and θ
With
Respect To
AGND,
DGND,
CGND
AGND,
DGND,
CGND
DGND,
CGND
AGND,
CGND
AGND,
DGND
AGND
AGND
DGND
DGND
CGND
DGND
JB
.
Rating
−0.3 V to +3.6 V
−0.3 V to +2.10 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to AVDD33 + 0.3 V
−1.0 V to AVDD33 + 0.3 V
−0.3 V to DVDD18 + 0.3 V
−0.3 V to DVDD18+ 0.3 V
−0.3 V to CVDD18 + 0.3 V
−0.3 V to IOVDD + 0.3 V
125°C
−65°C to +150°C
Rev. B | Page 9 of 72
Table 7. Thermal Resistance
Package Type
196-Ball CSP_BGA
196-Ball BGA_ED
MAXIMUM SAFE POWER DISSIPATION
The maximum junction temperature for the
With the thermal resistance of the molded package (CSP_BGA)
given for a 12 layer board, the maximum power that can be
dissipated in this package can be calculated as
To increase the maximum power, the
second package option (BGA_ED), which includes a heat spreader
on top of the package. Also, an external heat sink can be attached to
the top of the
power for each of these conditions is shown in Table 8.
With the thermal resistance of the heat spreader package (BGA_ED)
given for a 12-layer board, the maximum power that can be
dissipated in this package can be calculated as
To increase the maximum power, an external heat sink can be
attached to the top of the
maximum power for an external heat sink is shown in Table 8.
To aid in the selection of package, the maximum f
power dissipation over several operating conditions is shown in
Table 9. The maximum f
Note that, if the programmable inverse sinc filter is enabled, the
maximum f
ESD CAUTION
Power
Power
MAX
MAX
DAC
AD9148
rate specified in Table 9 decreases.
=
=
(
(
T
T
J
J
θ
θ
−
CSP_BGA package. The adjusted maximum
−
θ
24.7
19.2
18.1
18.0
20.9
16.2
15.2
15.0
JA
JA
T
T
DAC
JA
AD9148
A
A
)
)
rate applies to all interpolation rates.
=
=
θ
12.6
10.9
10.5
10.5
8.6
7.7
7.4
7.4
(
(
JB
125
125
18
15
BGA_ED package. The adjusted
−
−
0 .
0 .
θ
5.7
5.3
5.3
5.3
3.1
3.1
3.1
3.1
85
85
JC
AD9148
)
)
=
=
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
. 2
. 2
22
67
AD9148
DAC
is available in a
W
W
rate for a given
Notes
4-layer board,
25 PCB vias
8-layer board,
25 PCB vias
10-layer board,
25 PCB vias
12-layer board,
25 PCB vias
4-layer board,
25 PCB vias
8-layer board,
25 PCB vias
10-layer board,
25 PCB vias
12-layer board,
25 PCB vias
AD9148
is 125°C.