IRFI1010N International Rectifier, IRFI1010N Datasheet

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IRFI1010N

Manufacturer Part Number
IRFI1010N
Description
Trans MOSFET N-CH 55V 49A 3-Pin(3+Tab) TO-220 Full-Pak
Manufacturer
International Rectifier
Datasheet

Specifications of IRFI1010N

Package
3TO-220 Full-Pak
Channel Mode
Enhancement
Channel Type
N
Typical Fall Time
46 ns
Typical Rise Time
66 ns
Typical Turn-off Delay Time
40 ns
Typical Turn-on Delay Time
11 ns
Maximum Continuous Drain Current
49 A
Maximum Drain Source Voltage
55 V
Maximum Gate Source Voltage
±20 V

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRFI1010N
Manufacturer:
IR
Quantity:
12 500
Part Number:
IRFI1010N
Manufacturer:
IR
Quantity:
20 000
Company:
Part Number:
IRFI1010NPBF
Quantity:
30
Absolute Maximum Ratings
Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
The TO-220 Fullpak eliminates the need for additional
insulating hardware in commercial-industrial applications.
The moulding compound used provides a high isolation
capability and a low thermal resistance between the tab
and external heatsink. This isolation is equivalent to using
a 100 micron mica barrier with standard TO-220 product.
The Fullpak is mounted to a heatsink using a single clip or
by a single screw fixing.
Thermal Resistance
I
I
I
P
V
E
I
E
dv/dt
T
T
R
R
D
D
DM
AR
J
STG
D
GS
AS
AR
@ T
@ T
JC
JA
Advanced Process Technology
Isolated Package
High Voltage Isolation = 2.5KVRMS
Sink to Lead Creepage Dist. = 4.8mm
Fully Avalanche Rated
@T
C
C
C
= 25°C
= 25°C
= 100°C
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 srew
Junction-to-Case
Junction-to-Ambient
Parameter
Parameter
GS
GS
@ 10V
@ 10V
G
300 (1.6mm from case )
Typ.
–––
–––
D
S
HEXFET
10 lbf•in (1.1N•m)
-55 to + 175
TO-220 FULLPAK
Max.
0.38
290
± 20
360
5.8
5.0
49
35
58
43
IRFI1010N
R
®
DS(on)
Power MOSFET
V
Max.
DSS
I
2.6
65
D
= 49A
PD - 9.1373A
= 0.012
= 55V
Units
Units
W/°C
°C/W
V/ns
mJ
mJ
°C
W
A
V
A
8/25/97

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IRFI1010N Summary of contents

Page 1

... Operating Junction and J T Storage Temperature Range STG Soldering Temperature, for 10 seconds Mounting torque, 6- srew Thermal Resistance R Junction-to-Case JC R Junction-to-Ambient JA G Parameter @ 10V GS @ 10V GS Parameter PD - 9.1373A IRFI1010N ® HEXFET Power MOSFET 55V DSS R = 0.012 DS(on 49A D S TO-220 FULLPAK Max 290 58 0.38 ± ...

Page 2

... IRFI1010N Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage Q Total Gate Charge g Q Gate-to-Source Charge ...

Page 3

... D rain-to-S ource V oltage ( Fig 1. Typical Output Characteristics ° ° µ te-to-S o urce V oltage ( Fig 3. Typical Transfer Characteristics 1000 100 = IRFI1010N VGS TOP 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V BOTT OM 4.5V 100 4 .5V 20 µ IDTH 5° 0 Drain-to-Source V oltage ( Fig 2. Typical Output Characteristics ...

Page 4

... IRFI1010N 5000 4000 3000 2000 1000 Drain-to-Source V oltage ( Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 5° 25° ource-to-Drain Voltage ( Fig 7. Typical Source-Drain Diode Forward Voltage RTE 100 TES Total Gate Charge ( Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage 1000 OPE R ATIO LIMITE S(o n) 100 ...

Page 5

... RESPONSE) 0.01 0.00001 0.0001 Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case Fig 10a. Switching Time Test Circuit V 90% 125 150 175 10% ° Fig 10b. Switching Time Waveforms 0.001 0. Rectangular Pulse Duration (sec) 1 IRFI1010N D.U. 10V Pulse Width µs Duty Factor d(on) r ...

Page 6

... IRFI1010N 20V Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms Charge Fig 13a. Basic Gate Charge Waveform 1000 15 V 800 600 + 400 200 V ( 100 125 Starting T , Junction T emperature (°C) J Fig 12c. Maximum Avalanche Energy Vs. Drain Current Current Regulator Same Type as D ...

Page 7

... Fig 14. For N-Channel HEXFETS Circuit Layout Considerations Low Stray Inductance Ground Plane Low Leakage Inductance Current Transformer - + dv/dt controlled Driver same type as D.U.T. I controlled by Duty Factor "D" SD D.U.T. - Device Under Test P. Period Current di/dt Diode Recovery dv/dt Forward Drop 5% IRFI1010N + =10V ...

Page 8

... IRFI1010N Package Outline TO-220 Fullpak Outline Dimensions are shown in millimeters (inches) 10.60 (.417 ) 10.40 (.409 ) (.630 (.622 (.540 (.530) 1.40 (. 1.05 (. (.100) 2X Part Marking Information TO-220 Fullpak 010 E XAM PLE : T HIS IRF I840G ITH AS SE MBLY B1M LOT CODE E401 WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331 EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel 1883 732020 IR CANADA: 7321 Victoria Park Ave ...

Page 9

Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/ ...

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