CY62157DV18LL-70BVI Cypress Semiconductor Corp, CY62157DV18LL-70BVI Datasheet - Page 4

• Manufacturer Part Number: CY62157DV18LL-70BVI
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY62157DV18LL-70BVI

• Lead Free Status / Rohs Status: Not Compliant

Thermal Resistance
AC Test Loads and Waveforms
Data Retention Characteristics
Data Retention Waveform
Notes:
Document #: 38-05126 Rev. *B
V
I
t
t
7.
8.
CCDR
CDR
R
JA
JC
Parameter
DR
[7]
Parameter
BHE . BLE
Full device operation requires linear V
BHE
[6]
CE
CE
.
1
or
BLE is the AND of both BHE and BLE. Chip can be deselected by either disabling the chip enable signals or by disabling both BHE and BLE.
V
or
CC
2
Parameters
Thermal Resistance (Junction to
Ambient)
Thermal Resistance (Junction to
Case)
OUTPUT
V
Data Retention Current
Chip Deselect to Data
Retention Time
Operation Recovery Time
CC
R
V
R1
R2
T H
T H
[6]
V
INCLUDING
for Data Retention
CC
C = 30 pF
[6]
JIG AND
Equivalent to:
L
SCOPE
Description
Description
[8]
CC
R1
ramp from V
OUTPUT
V
CC(min.)
t
CDR
THÉVENIN EQUIVALENT
DR
R2
V
< 0.2V, V
0.2V
to V
CC
CC(min.)
Still Air, soldered on a 3 x 4.5 inch, two-layer
printed circuit board
= 1.0V, CE
V
CC
IN
DATA RETENTION MODE
> 100 s or stable at V
R
GND
TH
> V
Typ
13500
10800
6000
1.8V
0.80
Rise Time:
1 V/ns
Conditions
CC
1
> V
Test Conditions
V
DR
10%
0.2V or V
CC
V
> 1.0V
– 0.2V, CE
CC(min.)
ALL INPUT PULSES
IN
90%
<
> 100 s.
2
L
LL
Min.
1.0
t
RC
V
0
CC(min.)
t
R
90%
Fall Time:
Typ.
10%
1 V/ns
BGA
1
55
16
UNIT
[5]
V
CY62157DV18
Max.
1.95
10
3
Page 4 of 10
MoBL2
Unit
C/W
C/W
Unit
ns
ns
V
A