MT48LC8M8A2TG-75 Micron Technology Inc, MT48LC8M8A2TG-75 Datasheet - Page 71

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MT48LC8M8A2TG-75

Manufacturer Part Number
MT48LC8M8A2TG-75
Description
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC8M8A2TG-75

Organization
8Mx8
Density
64Mb
Address Bus
14b
Access Time (max)
6/5.4ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
140mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Not Compliant

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Package Dimensions
Figure 54:
PDF: 09005aef80725c0b/Source: 09005aef806fc13c
64MSDRAM_2.fm - Rev. N 12/08 EN
0.15
2X R 0.75
2X R 1.00
PIN #1 ID
+0.03
-0.02
54-Pin Plastic TSOP II (400 mil)
Notes:
10.16 ±0.08
11.76 ±0.20
1. All dimensions are in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
0.25mm per side.
2.80
2X 0.10
2X 0.71
SEE DETAIL A
22.22 ±.08
71
0.10
+0.10
-0.05
Micron Technology, Inc., reserves the right to change products or specifications without notice.
PLATED LEAD FINISH: 90% Sn, 10% Pb OR 100%Sn
PLASTIC PACKAGE MATERIAL: EPOXY NOVOLAC
PACKAGE WIDTH AND LENGTH DO NOT
INCLUDE MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE.
0.10
1.2 MAX
0.375 ±0.075 TYP
0.80 TYP
(FOR REFERENCE
ONLY)
0.50 ±0.10
64Mb: x4, x8, x16 SDRAM
DETAIL A
Package Dimensions
©2000 Micron Technology, Inc. All rights reserved.
GAGE PLANE
0.80
0.25

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