JL82575EB S LAAK Intel, JL82575EB S LAAK Datasheet - Page 4

• Manufacturer Part Number: JL82575EB S LAAK
• Manufacturer: Intel

Specifications of JL82575EB S LAAK

• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / Rohs Status: Compliant

Order Code
82575EB (Lead-free) JL82575EB
For more information, contact your
Intel sales representative.
*Other names and brands may be claimed as the property of others.
To see the full line of Intel® Ethernet Controllers, visit
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL
OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND
CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A
PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN
WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or
characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no
responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change
without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors
known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies
of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling
1-800-548-4725, or by visiting Intel’s Web Site http://www.intel.com/.
Copyright © 2007 Intel Corporation. All rights reserved.
Intel, the Intel logo, Intel. Leap ahead., and the Intel. Leap ahead. logo are trademarks of Intel Corporation in the U.S. and other countries.
Printed in USA
Features
Characteristics
Electrical
Typical targeted power dissipation (in active link state)
Environmental
Operating temperature
Physical
Implemented in 90nm complementary metal-oxide semiconductor
(CMOS) process
Package
0707/TAR/OCG/PP/800
Benefits
• 2.4 W, 0.8 W and 0.3 W
• 1000BASE-T, 0° to 55° C (with thermal management)
• 1000BASE-SX/LX (or SerDes backplane), 0° to 70° C
• Storage temperature, 65° C to 140° C
• Offers lowest geometry to minimize power and size while maintaining quality and reliability
• 25 mm x 25 mm 576-pin Flip-Chip Ball Grid Array (FC-BGA) package
Please Recycle
www.intel.com/network
317554-001US