M25PE16-VMW6G Micron Technology Inc, M25PE16-VMW6G Datasheet - Page 57

• Manufacturer Part Number: M25PE16-VMW6G
• Manufacturer: Micron Technology Inc

Specifications of M25PE16-VMW6G

• Cell Type: NOR
• Density: 16Mb
• Access Time (max): 8ns
• Interface Type: Serial (SPI)
• Boot Type: Not Required
• Address Bus: 1b
• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: -40C to 85C
• Package Type: SOIC W
• Program/erase Volt (typ): 2.7 to 3.6V
• Sync/async: Synchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8b
• Number Of Words: 2M
• Supply Current: 12mA
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / Rohs Status: Compliant

M25PE16
14
Revision history
Table 25.
07-Aug-2006
20-Nov-2006
16-Feb-2006
25-Mar-2008
13-Oct-2006
12-Apr-2007
01-Apr-2008
Date
Document revision history
Revision
0.1
1
2
3
4
5
6
Applied Numonyx branding.
Initial release.
Figure 3: Bus master and memory devices on the SPI bus
and
Section 4.8.1: Protocol-related protections
Address range for subsector 15 of sector 0 modified in
Memory
RESET signal behavior clarified in
(WRSR),
(PP),
(SSE),
Section 8: Reset
Low pulse. Table Reset while a Read, Program or Erase cycle is in
progres replaced by
Table 19
updated. Small text changes.
HPM2 specified in
Table 12: Device status after a Reset Low pulse
V
f
(50 MHz
TSL/W signal renamed as W, Top Sector Lock functionality removed,
HPM2 removed.
Paragraph added in
Absolute maximum
Table 18: AC characteristics (50 MHz operation)
Write protect setup and hold
updated (see
Document status promoted from preliminary data to datasheet.
supply voltage
memory devices on the SPI bus
replaced by an explanatory paragraph.
Behavior of WIP bit and lock registers specified at power-up in
Section 7: Power-up and
VFQFPN8 package specifications updated (see
Table
Removed ‘low voltage’ from the title.
Updated the value for the maximum clock frequency (from 50 to
75 MHz) through the document.
Added:
ECOPACK® text in
Modified:
Minor text changes.
R
IO
, t
W
max. modified in
Note 2
, t
Section 6.12: Page erase
22).
PW
Section 6.15: Bulk erase
Table 19: AC characteristics (75 MHz operation)
organization.
split into two tables (see also
operation).
Section 6.9: Page write
Section 3: SPI modes
, t
added.
PP
Table 23
and t
and
added to describe the device status after a RESET
HPM1 and HPM2
VSS ground
Section 12: Package
ratings. t
SSE
Section 3: SPI
Table 21: Timings after a Reset Low pulse
Table 13: Absolute maximum
and
modified in
power-down.
Figure
THSL
timing. SO8W package specifications
Changes
(PE),
added.
and
(BE).
updated, Note 2 removed and
(PW),
and t
30).
Section 6.5: Write status register
modes. T
Table 18: AC characteristics
Table 17: DC
paragraph. Small text changes.
Section 6.14: Subsector erase
Table
SHTL
Figure 3: Bus master and
Section 6.10: Page program
mechanical.
clarified.
timings removed from
LEAD
20). t
modified.
Figure 29
and
added to
Revision history
BE
characteristics.
ratings.
typical value
Figure 26:
Table 4:
and
and
updated
Table 13:
VCC
57/58