XPC8260ZUIFBC Freescale Semiconductor, XPC8260ZUIFBC Datasheet - Page 10

• Manufacturer Part Number: XPC8260ZUIFBC
• Description: IC MPU POWERQUICC II 480-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of XPC8260ZUIFBC

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 200MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 480-TBGA
• Family Name: MPC82XX
• Device Core: PowerQUICC II
• Device Core Size: 32b
• Frequency (max): 200MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.8V
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 480
• Package Type: TBGA
• Core Size: 32 Bit
• Program Memory Size: 32KB
• Cpu Speed: 133MHz
• Embedded Interface Type: I2C, MII, SPI, TDM, UTOPIA
• Digital Ic Case Style: TBGA
• No. Of Pins: 480
• Rohs Compliant: No
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

3
Electrical and Thermal Characteristics
2.2
Table 4
2.3
The average chip-junction temperature
where
For most applications P
T
Solving equations (1) and (2) for K gives:
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring
P
solving equations (1) and (2) iteratively for any value of T
10
D
J
Rev C.2 silicon only.
is the following:
(at equilibrium) for a known T
T
T
θ
P
P
P
P
K = P
describes thermal characteristics.
A
D
INT
I/O
D
JA
J
MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2
Thermal Characteristics
Power Considerations
= T
= ambient temperature °C
= P
= K/(T
= package thermal resistance
= power dissipation on input and output pins (determined by user)
= I
D
A
INT
DD
x (T
+ (P
1
2
3
Thermal resistance for TBGA
Note:
J
Assumes a single layer board with no thermal vias
Natural convection
Assumes a four layer board
+ P
x V
+ 273° C)
A
D
+ 273° C) +
I/O
x
DD
Characteristics
θ
I/O
JA
Watts (chip internal power)
)
< 0.3 x P
θ
JA
A
. Using this value of K
x P
INT
Table 4. Thermal Characteristics
,
junction to ambient
,
D
. If P
T
2
J
,
in °C can be obtained from the following:
I/O
Symbol
is neglected
θ
θ
θ
θ
JA
JA
JA
JA
,
°C/W
,
A
13.07
10.48
Value
9.55
7.78
the values of P
,
.
an approximate relationship between P
1
3
1
3
°C/W
°C/W
°C/W
°C/W
Unit
D
and T
Air Flow
J
1 m/s
1 m/s
NC
NC
can be obtained by
Freescale Semiconductor
2
(2)
(1)
(3)
D
and