MPC8347EVVALFB Freescale Semiconductor, MPC8347EVVALFB Datasheet - Page 56

• Manufacturer Part Number: MPC8347EVVALFB
• Description: IC MPU POWERQUICC II 672-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II PROr

Specifications of MPC8347EVVALFB

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 667MHz
• Voltage: 1.3V
• Mounting Type: Surface Mount
• Package / Case: 672-TBGA
• Processor Series: MPC8xxx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: MPC8349E-MITXE
• Maximum Clock Frequency: 667 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• I/o Voltage: 1.8 V, 2.5 V, 3.3 V
• Minimum Operating Temperature: 0 C
• Core Size: 32 Bit
• Program Memory Size: 64KB
• Cpu Speed: 667MHz
• Embedded Interface Type: I2C, SPI, USB, UART
• Digital Ic Case Style: TBGA
• No. Of Pins: 672
• Rohs Compliant: Yes
• Family Name: MPC83xx
• Device Core: PowerQUICC II Pro
• Device Core Size: 32b
• Frequency (max): 667MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.3V
• Operating Supply Voltage (max): 1.36V
• Operating Supply Voltage (min): 1.24V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 672
• Package Type: TBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Package and Pin Listings
18.2
Figure 39
672-TBGA package.
56
Figure 39. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC8347E TBGA
Mechanical Dimensions for the MPC8347E TBGA
shows the mechanical dimensions and bottom surface nomenclature for the MPC8347E,
MPC8347E PowerQUICC™ II Pro Integrated Host Processor Hardware Specifications, Rev. 11
Notes:
1.All dimensions are in millimeters.
2.Dimensions and tolerances per ASME Y14.5M-1994.
3.Maximum solder ball diameter measured parallel to datum A.
4.Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5.Parallelism measurement must exclude any effect of mark on top surface of package.
Freescale Semiconductor