MPC8245LZU333D Freescale Semiconductor, MPC8245LZU333D Datasheet - Page 31

• Manufacturer Part Number: MPC8245LZU333D
• Description: IC MPU 32BIT 333MHZ 352-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of MPC8245LZU333D

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 333MHz
• Voltage: 2V
• Mounting Type: Surface Mount
• Package / Case: 352-TBGA
• Core Size: 32 Bit
• Program Memory Size: 32KB
• Cpu Speed: 333MHz
• Embedded Interface Type: I2C
• Digital Ic Case Style: TBGA
• No. Of Pins: 352
• Supply Voltage Range: 1.9V To 2.2V
• Rohs Compliant: No
• Family Name: MPC82XX
• Device Core: PowerPC
• Device Core Size: 64b
• Frequency (max): 333MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 2/2.1/3.3V
• Operating Supply Voltage (max): 2.2/3.465V
• Operating Supply Voltage (min): 1.9/3.135V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 352
• Package Type: TBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

5
This section details package parameters, pin assignments, and dimensions.
5.1
The MPC8245 uses a 35 mm × 35 mm, cavity-up, 352-pin tape ball grid array (TBGA) package. The
package parameters are as follows.
Freescale Semiconductor
Package Description
Package Outline
Interconnects
Pitch
Solder Balls
Solder Ball Diameter
Maximum Module Height
Co-Planarity Specification
Maximum Force
Package Parameters
TDI, TMS
TDO
TDO
TCK
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Figure 23. Test Access Port Timing Diagram
35 mm × 35 mm
1.27 mm
VV (Lead-free version of package)
1.65 mm
0.15 mm
6.0 lbs. total, uniformly distributed over package (8 grams/ball)
352
ZU (TBGA package)
0.75 mm
12
13
—
62 Sn/36 Pb/2 Ag
Input Data Valid
10
Output Data Valid
11
—
95.5 Sn/4.0 Ag/0.5 Cu
Package Description
31