MPC8360EVVAJDGA Freescale Semiconductor, MPC8360EVVAJDGA Datasheet - Page 68

• Manufacturer Part Number: MPC8360EVVAJDGA
• Description: IC MPU POWERQUICC II PRO 740TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II PROr

Specifications of MPC8360EVVAJDGA

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 533MHz
• Voltage: 1.2V
• Mounting Type: Surface Mount
• Package / Case: 740-TBGA
• Processor Series: MPC8xxx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: MPC8360E-RDK
• Maximum Clock Frequency: 533 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• I/o Voltage: 1.8 V, 2.5 V, 3.3 V
• Minimum Operating Temperature: 0 C
• Core Size: 32 Bit
• Program Memory Size: 64KB
• Cpu Speed: 533MHz
• Embedded Interface Type: I2C, SPI, USB, UART
• Digital Ic Case Style: TBGA
• No. Of Pins: 740
• Rohs Compliant: Yes
• For Use With: MPC8360EA-MDS-PB - KIT APPLICATION DEV 8360 SYSTEMMPC8360E-RDK - BOARD REFERENCE DESIGN FOR MPC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Package and Pin Listings
21 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8360E/58E is
available in a tape ball grid array (TBGA), see
and
21.1
The package parameters for rev. 2.0 silicon are as provided in the following list. The package type is
37.5 mm × 37.5 mm, 740 tape ball grid array (TBGA).
68
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 4
Section 21.2, “Mechanical Dimensions of the TBGA Package,”
Package outline
Interconnects
Pitch
Module height (typical)
Solder Balls
Ball diameter (typical)
Package Parameters for the TBGA Package
Section 21.1, “Package Parameters for the TBGA Package,”
740
1.00 mm
1.46 mm
62 Sn/36 Pb/2 Ag (ZU package)
95.5 Sn/0.5 Cu/4Ag (VV package)
0.64 mm
37.5 mm × 37.5 mm
for information on the package.
Freescale Semiconductor