MT46V32M16D3TH-75 Micron Technology Inc, MT46V32M16D3TH-75 Datasheet - Page 22

• Manufacturer Part Number: MT46V32M16D3TH-75
• Manufacturer: Micron Technology Inc
• Type: DDR SDRAMr

Specifications of MT46V32M16D3TH-75

• Organization: 32Mx16
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 750ps
• Maximum Clock Rate: 266MHz
• Operating Supply Voltage (typ): 2.5V
• Package Type: TSOP
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 2.7V
• Operating Supply Voltage (min): 2.3V
• Supply Current: 145mA
• Pin Count: 66
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Not Compliant

Table 14:
Table 15:
Table 16:
Table 17:
PDF: 09005aef80a1d9d4/Source: 09005aef82a95a3a
DDR_x4x8x16_Core2.fm - 512Mb DDR: Rev. N; Core DDR Rev. B 2/09 EN
Parameter
Parameter
Parameter
Parameter
Delta input/output capacitance: DQ0–DQ3 (x4), DQ0–DQ7 (x8)
Delta input capacitance: Command and address
Delta input capacitance: CK, CK#
Input/output capacitance: DQ, DQS, DM
Input capacitance: Command and address
Input capacitance: CK, CK#
Input capacitance: CKE
Delta input/output capacitance: DQ, DQS, DM
Delta input capacitance: Command and address
Delta input capacitance: CK, CK#
Input/output capacitance: DQ, DQS, DM
Input capacitance: Command and address
Input capacitance: CK, CK#
Input capacitance: CKE
Delta input/output capacitance: DQ0–DQ7, LDQS, LDM
Delta input/output capacitance: DQ8–DQ15, UDQS, UDM
Delta input capacitance: Command and address
Delta input capacitance: CK, CK#
Input/output capacitance: DQ, LDQS, UDQS, LDM, UDM
Input capacitance: Command and address
Input capacitance: CK, CK#
Input capacitance: CKE
Delta input/output capacitance: DQ0–DQ7, LDQS, LDM
Delta input/output capacitance: DQ8–DQ15, UDQS, UDM
Delta input capacitance: Command and address
Delta input capacitance: CK, CK#
Input/output capacitance: DQ, LDQS, UDQS, LDM, UDM
Input capacitance: Command and address
Input capacitance: CK, CK#
Input capacitance: CKE
Capacitance (x4, x8 TSOP)
Note: 14 applies to the entire table; Notes appear on page 35
Capacitance (x4, x8 FBGA)
Note: 14 applies to the entire table; Notes appear on page 35
Capacitance (x16 TSOP)
Note: 14 applies to the entire table; Notes appear on page 35
Capacitance (x16 FBGA)
Note: 14 applies to the entire table; Notes appear on page 35
22
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Symbol
Symbol
Symbol
Symbol
Electrical Specifications – DC and AC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
IO
IO
IO
IO
I
I
I
I
I
I
I
I
I
I
I
I
IOU
IOU
IOL
IOL
1
2
3
1
2
3
1
2
3
1
2
3
IO
IO
I
I
I
I
I
I
I
I
1
2
1
2
1
2
1
2
512Mb: x4, x8, x16 DDR SDRAM
Min
Min
Min
Min
4.0
2.0
2.0
2.0
3.5
1.5
1.5
1.5
4.0
2.0
2.0
2.0
3.5
1.5
1.5
1.5
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Max
Max
Max
Max
0.50
0.50
0.25
0.50
0.50
0.25
0.50
0.50
0.50
0.25
0.50
0.50
0.50
0.25
©2000 Micron Technology, Inc. All rights reserved.
5.0
3.0
3.0
3.0
4.5
2.5
2.5
2.5
5.0
3.0
3.0
3.0
4.5
2.5
2.5
2.5
Units
Units
Units
Units
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
Notes
Notes
Notes
Notes
25
30
30
25
30
30
25
25
30
30
25
25
30
30