MT9JSF12872AY-1G1D1 Micron Technology Inc, MT9JSF12872AY-1G1D1 Datasheet

MT9JSF12872AY-1G1D1

Manufacturer Part Number
MT9JSF12872AY-1G1D1
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT9JSF12872AY-1G1D1

Main Category
DRAM Module
Sub-category
DDR3 SDRAM
Module Type
240UDIMM
Device Core Size
72b
Organization
128Mx72
Total Density
1GByte
Chip Density
1Gb
Maximum Clock Rate
1.333GHz
Operating Supply Voltage (typ)
1.5V
Operating Current
1.8A
Number Of Elements
9
Operating Supply Voltage (max)
1.575V
Operating Supply Voltage (min)
1.425V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
240
Mounting
Socket
Lead Free Status / Rohs Status
Compliant
DDR3 SDRAM UDIMM
MT9JSF12872A – 1GB
For component data sheets, refer to Micron’s Web site:
Features
• DDR3 functionality and operations supported as per
• 240-pin, unbuffered dual in-line memory module
• Fast data transfer rates: PC3-10600, PC3-8500, or
• 1GB (128 Meg x 72)
• V
• V
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination (ODT) for
• Single rank
• On-board I
• 8 internal device banks
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Pb-free
• Fly-by topology
• Terminated control, command, and address bus
Table 1:
PDF: 09005aef8300b5ee/Source: 09005aef8300b63a
JSF9C128x72A.fm - Rev. A 3/08 EN
Speed
Grade
the component data sheet
(UDIMM)
PC3-6400
data, strobe, and mask signals
serial presence-detect (SPD) EEPROM
via the mode register set (MRS)
-1G5
-1G4
-1G3
-1G1
-1G0
-80C
-80B
DD
DDSPD
= 1.5V ±0.075V
= +3.0V to +3.6V
Nomenclature
2
Key Timing Parameters
C temperature sensor with integrated
PC3-10600
PC3-10600
PC3-10600
Products and specifications discussed herein are subject to change by Micron without notice.
Industry
PC3-8500
PC3-8500
PC3-6400
PC3-6400
CL = 10
1333
1333
1333
CL = 9
1333
1333
Data Rate (MT/s)
CL = 8
1333
1066
1066
1066
1066
1GB (x72, ECC, SR) 240-Pin DDR3 SDRAM UDIMM
www.micron.com
1
CL = 7
1066
1066
1066
Figure 1:
Notes: 1. Contact Micron for industrial temperature
PCB height: 30.0mm (1.181in)
Options
• Operating temperature
• Package
• Frequency/CAS latency
– Commercial (0°C ≤ T
– Industrial (–40°C ≤ T
– 240-pin DIMM
– 1.5ns @ CL = 8 (DDR3-1333)
– 1.5ns @ CL = 9 (DDR3-1333)
– 1.5ns @ CL = 10 (DDR3-1333)
– 1.87ns @ CL = 7 (DDR3-1066)
– 1.87ns @ CL = 8 (DDR3-1066)
– 2.5ns @ CL = 5 (DDR3-800)
– 2.5ns @ CL = 6 (DDR3-800)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2. Not recommended for new designs.
CL = 6
module offerings.
800
800
800
800
800
800
800
240-Pin UDIMM (MO-269 R/C D)
CL = 5
800
800
A
A
1
≤ +85°C)
≤ +70°C)
13.125
t
(ns)
13.5
12.5
©2008 Micron Technology, Inc. All rights reserved.
RCD
12
15
15
15
2
2
2
13.125
(ns)
12.5
13.5
t
12
15
15
15
RP
Marking
Features
None
-1G5
-1G4
-1G3
-1G1
-1G0
-80C
-80B
Y
I
50.625
(ns)
49.5
52.5
52.5
t
48
51
50
RC

Related parts for MT9JSF12872AY-1G1D1

MT9JSF12872AY-1G1D1 Summary of contents

Page 1

... For component data sheets, refer to Micron’s Web site: Features • DDR3 functionality and operations supported as per the component data sheet • 240-pin, unbuffered dual in-line memory module (UDIMM) • Fast data transfer rates: PC3-10600, PC3-8500, or PC3-6400 • 1GB (128 Meg x 72) • ...

Page 2

... The data sheet for the base device can be found on Micron’s Web site. 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Consult factory for current revision codes. Example: MT9JSF12872AY-1G1D1. PDF: 09005aef8300b5ee/Source: 09005aef8300b63a JSF9C128x72A.fm - Rev. A 3/08 EN ...

Page 3

Pin Assignments and Descriptions Table 4: Pin Assignments 240-Pin DDR3 UDIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol DQ25 61 REF ...

Page 4

... Input with write data. Center-aligned with write data. SDA I/O Serial data: SDA is a bidirectional pin used to transfer addresses and data into and out of the temperature sensor/SPD EEPROM on the module on the I EVENT# Output Temperature event: The EVENT# pin is asserted by the temperature sensor when critical (open drain) temperature thresholds have been exceeded ...

Page 5

... Ground Supply Termination voltage: Used for control, command, and address ( – No connect: These pins are not connected on the module. PDF: 09005aef8300b5ee/Source: 09005aef8300b63a JSF9C128x72A.fm - Rev. A 3/08 EN 1GB (x72, ECC, SR) 240-Pin DDR3 SDRAM UDIMM Pin Assignments and Descriptions DD /2). DD Micron Technology, Inc., reserves the right to change products or specifications without notice. ...

Page 6

Functional Block Diagram Figure 2: Functional Block Diagram S0# DQS0# DQS0 DM0 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQS1# DQS1 DM1 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DQS2# DQS2 DM2 DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 ...

Page 7

... DRAM is connected to a single trace and terminated (rather than a tree structure, where the termination is off the module near the connector). Inherent to fly-by topology, the timing skew between the clock and DQS signals can be easily accounted for by using the write-leveling feature of DDR3 ...

Page 8

... Serial Presence-Detect EEPROM Operation DDR3 SDRAM modules incorporate serial presence-detect. The SPD data is stored in a 256-byte EEPROM. The first 128 bytes are programmed by Micron to comply with JEDEC specification JC-45 “Appendix X: Serial Presence Detect (SPD) for DDR3 SDRAM Modules” (pending approval). These bytes identify module-specific timing parameters, configuration information, and physical attributes ...

Page 9

... Electrical Specifications Stresses greater than those listed in Table 6 may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other conditions outside those indicated in each device’s data sheet is not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability ...

Page 10

... Micron encourages designers to simulate the signal characteristics of the system’s memory bus to ensure adequate signal integrity of the entire memory system. Power Operating voltages are specified at the DRAM, not at the edge connector of the module. Designers must account for any system voltage drops at anticipated power levels to ensure the required supply voltage is maintained. ...

Page 11

I Specifications DD Table 9: DDR3 I Specifications and Conditions – 1GB DD Values are for the MT41J128M8 DDR3 SDRAM only and are computed from values specified in the 1Gb (128 Meg x 8) component data sheet Parameter Operating current ...

Page 12

... Temperature Sensor with Serial Presence-Detect EEPROM The temperature sensor continuously monitors the module’s temperature and can be read back at any time over the I Table 10: Temperature Sensor with Serial Presence-Detect EEPROM Operating Conditions Parameter/Condition Supply voltage Supply current 3.3V DD Input high voltage: Logic 1; SCL, SDA Input low voltage: Logic 0 ...

Page 13

The interrupt mode enables software to reset EVENT# after a critical temperature threshold has been detected. Threshold points are set in the configuration register by the user. This mode triggers the critical temperature limit and both the MIN and MAX ...

Page 14

Table 12: Temperature Sensor Registers Name Pointer register Capability register Configuration register Alarm temperature upper boundary register Alarm temperature lower boundary register Critical temperature register Temperature register Pointer Register The pointer register selects which of the 16-bit registers is being ...

Page 15

Table 16: Capability Register Bit Descriptions Bit Description 0 Basic capability 1: Has alarm and critical trip point capabilities 1 Accuracy 0: ±2°C over the active range and ±3°C over the monitor range 1: ±1°C over the active range and ...

Page 16

Table 18: Configuration Register Bit Descriptions (continued) Bit Description 5 Clear event 0: No effect 1: Clears the event when the temperature sensor is in the interrupt mode 6 Alarm window lock bit 0: Alarm trips are not locked and ...

Page 17

Table 19: Hysteresis Temperature Condition Gradient Sets Falling Clears Rising Temperature Format The temperature trip point registers and temperature readout register use a “2’s complement” format to enable negative numbers. The least significant bit (LSB) is equal to 0.0625°C or ...

Page 18

Temperature Register The temperature register is a read-only register that provides the current temperature detected by the temperature sensor. The LSB for this register is 0.0625°C with a resolu- tion of 0.0625°C. The most significant bit (MSB) is 128°C in ...

Page 19

... U10 0.76 (0.03) R 1.0 (0.039) TYP 123.0 (4.84) TYP Back view No components this side of module 5.0 (0.197) TYP 71.0 (2.79) 47.0 (1.85) TYP tive owners. Micron Technology, Inc., reserves the right to change products or specifications without notice. 19 Module Dimensions U8 U9 30.5 (1.20) 29 ...

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