MT8HTF12864HDZ-667H1 Micron Technology Inc, MT8HTF12864HDZ-667H1 Datasheet - Page 10

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MT8HTF12864HDZ-667H1

Manufacturer Part Number
MT8HTF12864HDZ-667H1
Description
MODULE DDR2 SDRAM 1GB 200SODIMM
Manufacturer
Micron Technology Inc
Series
-r
Datasheet

Specifications of MT8HTF12864HDZ-667H1

Main Category
DRAM Module
Sub-category
DDR2 SDRAM
Module Type
200SODIMM
Device Core Size
64b
Organization
128Mx64
Total Density
1GByte
Chip Density
1Mb
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Operating Current
908mA
Number Of Elements
8
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
200
Mounting
Socket
Memory Type
DDR2 SDRAM
Memory Size
1GB
Speed
667MT/s
Features
-
Package / Case
200-SODIMM
Lead Free Status / Rohs Status
Compliant
I
Table 8: DDR2 I
Values shown for MT47H64M16 DDR2 SDRAM only and are computed from values specified in the 1Gb (64 Meg x 16) com-
ponent data sheet
PDF: 09005aef831ec770
htf8c128x64hdz.pdf - Rev. C 3/10 EN
Parameter
Operating one bank active-precharge current:
t
inputs are switching; Data bus inputs are switching
Operating one bank active-read-precharge current: I
(I
CKE is HIGH, S# is HIGH between valid commands; Address bus inputs are switching;
Data pattern is same as I
Precharge power-down current: All device banks idle;
Other control and address bus inputs are stable; Data bus inputs are floating
Precharge quiet standby current: All device banks idle;
HIGH, S# is HIGH; Other control and address bus inputs are stable; Data bus inputs
are floating
Precharge standby current: All device banks idle;
HIGH; Other control and address bus inputs are switching; Data bus inputs are switch-
ing
Active power-down current: All device banks open;
(I
Data bus inputs are floating
Active standby current: All device banks open;
(I
and address bus inputs are switching; Data bus inputs are switching
Operating burst write current: All device banks open; Continuous burst writes; BL
= 4, CL = CL (I
HIGH, S# is HIGH between valid commands; Address bus inputs are switching; Data
bus inputs are switching
Operating burst read current: All device banks open; Continuous burst read, I
= 0mA; BL = 4, CL = CL (I
(I
ing; Data bus inputs are switching
Burst refresh current:
val; CKE is HIGH, S# is HIGH between valid commands; Other control and address bus
inputs are switching; Data bus inputs are switching
Self refresh current: CK and CK# at 0V; CKE ≤ 0.2V; Other control and address bus
inputs are floating; Data bus inputs are floating
DD
RAS =
DD
DD
DD
DD
), AL = 0;
); CKE is LOW; Other control and address bus inputs are stable;
),
); CKE is HIGH, S# is HIGH between valid commands; Address bus inputs are switch-
Specifications
t
RP =
t
RAS MIN (I
t
RP (I
t
DD
CK =
), AL = 0;
DD
DD
DD
); CKE is HIGH, S# is HIGH between valid commands; Other control
t
CK (I
); CKE is HIGH, S# is HIGH between valid commands; Address bus
Specifications and Conditions – 1GB (Die Revision E)
t
DD
DD
DD4W
CK =
t
CK =
),
), AL = 0;
t
RC =
t
CK (I
t
CK (I
t
RC (I
DD
t
DD
CK =
); REFRESH command at every
),
DD
t
RAS =
),
t
CK (I
t
RAS =
DD
t
RAS MAX (I
),
t
CK =
t
t
RAS MIN (I
t
CK =
RAS =
t
CK =
t
CK =
t
CK (I
t
CK (I
t
OUT
CK =
t
t
t
CK (I
RAS MAX (I
CK =
DD
10
t
DD
CK
= 0mA; BL = 4, CL = CL
DD
),
DD
),
t
DD
t
),
CK (I
),
RP =
t
t
CK (I
); CKE is HIGH, S# is
RAS =
t
t
RCD =
RC =
t
1GB (x64, DR) 200-Pin DDR2 SODIMM
RFC (I
DD
Fast PDN exit
MR[12] = 0
Slow PDN exit
MR[12] = 1
t
DD
Micron Technology, Inc. reserves the right to change products or specifications without notice.
RP (I
DD
); CKE is LOW;
t
t
); CKE is
RC (I
RAS MAX
),
t
RCD (I
DD
DD
t
RP =
) inter-
); CKE is
DD
),
DD
t
OUT
RP
);
Symbol
I
I
I
I
I
I
I
DD4W
DD2Q
I
I
DD2N
DD3N
DD4R
I
I
DD2P
DD3P
DD0
DD1
DD5
DD6
1
1
2
2
2
2
1
2
2
2
1
© 2008 Micron Technology, Inc. All rights reserved.
I
DD
-800
1288
1308
2240
628
728
600
640
320
680
56
80
56
Specifications
2160
-667
568
548
520
560
240
600
828
908
56
80
56
Units
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA

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