AD9245BCPZ-80 Analog Devices Inc, AD9245BCPZ-80 Datasheet - Page 29

• Manufacturer Part Number: AD9245BCPZ-80
• Description: IC ADC 14BIT 80MSPS 3V 32-LFCSP
• Manufacturer: Analog Devices Inc

Specifications of AD9245BCPZ-80

• Data Interface: Parallel
• Number Of Bits: 14
• Sampling Rate (per Second): 80M
• Number Of Converters: 3
• Power Dissipation (max): 414mW
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN, CSP Exposed Pad
• Resolution (bits): 14bit
• Sampling Rate: 80MSPS
• Input Channel Type: Differential, Single Ended
• Supply Voltage Range - Analog: 2.7V To 3.6V
• Supply Current: 122mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AD9245BCP-80EBZ - BOARD EVAL FOR AD9245BCP-80AD9245BCP-40EBZ - BOARD EVAL FOR AD9245BCP-40AD9245BCP-20EBZ - BOARD EVAL FOR AD9245BCP-20
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD9245BCP-80
AD9245BCPRL7–80
AD9245BCPZ-80
AD9245BCPZRL7-80
AD9245BCPZ-65
AD9245BCPZRL7-65
AD9245BCPZ-40
AD9245BCPZRL7-40
AD9245BCPZ-20
AD9245BCPZRL7-20
AD9245BCP-80EB
AD9245BCP-65EB
AD9245BCP-40EB
AD9245BCP-20EB
1
2
It is recommended that the exposed paddle be soldered to the ground plane for the LFCSP package. There is an increased reliability of the solder joints, and the
maximum thermal capability of the package is achieved with the exposed paddle soldered to the customer board.
Z = Pb-free part.
2
2
2
2
2
2
2
2
INDICATOR
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
1.00
0.85
0.80
PIN 1
12° MAX
SEATING
PLANE
BSC SQ
VIEW
TOP
5.00
Figure 58. 32-Lead Frame Chip Scale Package [LFCSP_VQ]
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
0.80 MAX
0.65 TYP
0.30
0.23
0.18
5 mm × 5 mm Body, Very Thin Quad
Package Description
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
Evaluation Board
Evaluation Board
Evaluation Board
Evaluation Board
Dimensions shown in millimeters
BSC SQ
4.75
0.20 REF
Rev. D | Page 29 of 32
0.05 MAX
0.02 NOM
(CP-32-2)
0.60 MAX
COPLANARITY
BSC
0.50
0.40
0.30
0.50
0.08
1
24
17
16
25
(BOTTOM VIEW)
0.60 MAX
EXPOSED
PAD
32
9
1
8
3.50 REF
3.25
3.10 SQ
2.95
0.25 MIN
PIN 1
INDICATOR
Package Option
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
AD9245