MT36HTF51272FZ-667H1N8 Micron Technology Inc, MT36HTF51272FZ-667H1N8 Datasheet - Page 2

• Manufacturer Part Number: MT36HTF51272FZ-667H1N8
• Description: MODULE DDR2 SDRAM 4GB 240FBDIMM
• Manufacturer: Micron Technology Inc
• Series: -r

Specifications of MT36HTF51272FZ-667H1N8

• Main Category: DRAM Module
• Sub-category: DDR2 SDRAM
• Module Type: 240FBDIMM
• Device Core Size: 72b
• Organization: 512Mx72
• Chip Density: 1Gb
• Package Type: FBDIMM
• Maximum Clock Rate: 667MHz
• Operating Supply Voltage (typ): 1.8V
• Number Of Elements: 36
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: 0C to 95C
• Operating Temperature Classification: Commercial
• Pin Count: 240
• Mounting: Socket
• Memory Type: DDR2 SDRAM
• Memory Size: 4GB
• Speed: 667MT/s
• Features: -
• Package / Case: 240-FBDIMM
• Lead Free Status / RoHS Status: Supplier Unconfirmed

Table 2:
Table 3:
PDF: 09005aef83d491e1Source: 09005aef83d49311
htf36c512x72fz.fm - Rev. A 11/09 EN
Parameter
Part Number
Refresh count
Device bank address
Device configuration
Row address
Column address
Module rank address
MT36HTF51272FZ-80E__
MT36HTF51272FZ-667__
Addressing
Part Numbers and Timing Parameters – 4GB
Base device: MT47H256M4,
2
Notes: 1. Data sheets for the base device can be found on Micron’s Web site.
2. All part numbers end with a four-place code (not shown), designating component, PCB,
and AMB revisions. Consult factory for current revision codes.
Example: MT36HTF51272FZ-667H1N8.
Module
Density
4GB
4GB
1
1Gb DDR2 SDRAM
Configuration
512 Meg x 72
512 Meg x 72
4GB (x72, DR) 240-Pin DDR2 SDRAM FBDIMM
2
Bandwidth
Module
6.4 GB/s
5.3 GB/s
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2.5ns/800 MT/s
3ns/667 MT/s
Data Rate
Memory
Clock/
1Gb (256 Meg x4)
2K A[11, 9:0]
16K A[13:0]
8 BA[2:0]
2 S#[1:0]
4GB
8K
©2009 Micron Technology, Inc. All rights reserved.
(CL-
Clock Cycles
t
5-5-5
5-5-5
RCD-
t
RP)
Features
Transfer
4.8 GT/s
4 GT/s
Rate
Link