STPCI2HDYI STMicroelectronics, STPCI2HDYI Datasheet - Page 102
STPCI2HDYI
Manufacturer Part Number
STPCI2HDYI
Description
Manufacturer
STMicroelectronics
Datasheet
1.STPCI2HDYI.pdf
(108 pages)
Specifications of STPCI2HDYI
Operating Temperature (min)
-40C
Operating Temperature (max)
115C
Processing Unit
Microprocessor
Operating Supply Voltage (min)
2.45/3V
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
2.7/3.6V
Package Type
BGA
Screening Level
Industrial
Pin Count
516
Mounting
Surface Mount
Rad Hardened
No
Lead Free Status / RoHS Status
Supplier Unconfirmed
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STPC® ATLAS
As the PCB acts as a heat sink, the layout of top
and ground layers must be done with care to
maximize the board surface dissipating the heat.
The only limitation is the risk of losing routing
channels.
102/108
Figure 6-36. Layout for Good Thermal Dissipation - top layer
A
1
Figure 6-36
and
Figure 6-37
STPC ball
Via
Not Connected ball
show a
routing with a good thermal dissipation thanks to
an optimized placement of power and signal vias.
The ground plane should be on bottom layer for
the best heat spreading (thicker layer than internal
ones) and dissipation (direct contact with air). .
GND ball
3.3V ball
2.5V ball (Core / PLLs)
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