MC10XS3435DPNAR2 Freescale, MC10XS3435DPNAR2 Datasheet - Page 48

• Manufacturer Part Number: MC10XS3435DPNAR2
• Manufacturer: Freescale

Specifications of MC10XS3435DPNAR2

• Switch Type: High Side
• Power Switch Family: MC10XS3435
• Input Voltage: -0.3 to 5.8V
• Output Current: 6A
• Number Of Outputs: 4
• Mounting: Surface Mount
• Supply Current: 6.5mA
• Package Type: PQFN EP
• Operating Temperature (min): -40C
• Operating Temperature Classification: Automotive
• Pin Count: 24
• Lead Free Status / RoHS Status: Compliant

Device on Thermal Test Board
48
10XS3435
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 1.0)
Material:
Outline:
Area A:
Ambient Conditions:
Figure 20. Steady State Thermal Resistance in Dependence on Heat Spreading Area;
65.00
60.00
55.00
50.00
45.00
40.00
35.00
30.00
25.00
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Cu buried traces thickness 0.035mm
76.2 mm x 114.3 mm board area,
including edge connector for thermal
testing, 74 mm x 74 mm buried
layers area
Cu heat-spreading areas on board
surface
Natural convection, still air
0
1s JEDEC Thermal Test Board with Spreading Areas
100
RJA11
Heat spreading area [sqmm]
200
RJA12=RJA21
Table 26. Thermal Resistance Performance
ambient air.
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
300
Resistance
R
Thermal
R
This device is a dual die package. Index m indicates the
θ
JA mn
θJA
is the thermal resistance between die junction and
400
Area A
(mm
150
300
450
600
0
2
RJA22
)
Analog Integrated Circuit Device Data
1 = Power Chip, 2 = Logic Chip
m = 1,
47.77
42.90
40.95
39.85
38.96
500
n = 1
Freescale Semiconductor
m = 1, n = 2
m = 2, n = 1
600
36.90
33.21
31.78
30.89
30.21
m = 2,
54.35
51.07
49.63
48.61
47.90
n = 2
(°C/W)