mc10xs3435 Freescale Semiconductor, Inc, mc10xs3435 Datasheet
mc10xs3435
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mc10xs3435 Summary of contents
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... I/O RST SO SI I/O IN0 I/O IN1 I/O IN2 I/O IN3 A/D CSNS FSI GND Document Number: MC10XS3435 Rev. 6.0, 12/2008 10XS3435 HIGH SIDE SWITCH PNA SUFFIX 98ARL10596D 24-PIN PQFN ORDERING INFORMATION Temperature Device Package Range ( 40°C to 125°C 24 PQFN PWR HS0 LOAD HS1 LOAD ...
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INTERNAL BLOCK DIAGRAM VDD Vdd Failure I UP Detection CS SCLK I DWN SO SI RST WAKE FS IN0 IN1 IN2 IN3 DWN DWN DWN PWM Module Calibratable Oscillator V REG Programmable FSI Watchdog Over-temperature Prewarning Figure ...
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Transparent Top View of Package Table 1. 10XS3435 Pin Definitions A functional description of each pin can be found in the Functional Pin Description section beginning on page 23. Pin Pin Pin Name Number Function 1 CSNS Output 2 IN0 ...
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PIN CONNECTIONS Table 1. 10XS3435 Pin Definitions (continued) A functional description of each pin can be found in the Functional Pin Description section beginning on page 23. Pin Pin Pin Name Number Function 14, 17, 23 GND Ground Positive Power ...
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Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings ELECTRICAL RATINGS V Supply Voltage Range PWR Load Dump at 25°C (400 ...
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ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings (continued) All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings THERMAL RESISTANCE (5) Thermal Resistance Junction to ...
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STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics Characteristics noted under conditions 6.0V ≤ V noted. Typical values noted reflect the approximate parameter means at T noted. Characteristic POWER INPUTS Battery Supply Voltage Range Fully Operational (7) Extended mode (8) ...
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ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V noted. Typical values noted reflect the approximate parameter means at T noted. Characteristic OUTPUTS HS0 TO HS3 HS[0,1] Output Drain-to-Source ON Resistance ...
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Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V noted. Typical values noted reflect the approximate parameter means at T noted. Characteristic OUTPUTS HS0 TO HS3 (CONTINUED) HS[0,1] Output Over-current Detection Levels (6.0V < V 28W ...
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ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V noted. Typical values noted reflect the approximate parameter means at T noted. Characteristic OUTPUTS HS0 TO HS3 (CONTINUED) HS[0,1] Current Sense Ratio ...
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Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V noted. Typical values noted reflect the approximate parameter means at T noted. Characteristic OUTPUTS HS0 TO HS3 (CONTINUED) HS[2,3] Output Over-current Detection Levels (6.0V < V HS[2,3] ...
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ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V noted. Typical values noted reflect the approximate parameter means at T noted. Characteristic CONTROL INTERFACE (19) Input Logic High Voltage (19) Input ...
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DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic POWER OUTPUT TIMING HS0 TO HS3 Output Rising Medium Slew ...
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ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic POWER OUTPUT TIMING HS0 TO HS3 (CONTINUED) ...
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Table 4. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic POWER OUTPUT TIMING HS0 TO HS3 (CONTINUED) HS[0,1] Output Over-current Time Step ...
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ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic POWER OUTPUT TIMING HS0 TO HS3 (CONTINUED) ...
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Table 4. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic POWER OUTPUT TIMING HS0 TO HS3 (CONTINUED) HS[0,1] Bulb Cooling Time Step ...
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ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic PWM MODULE TIMING Input PWM Clock Range ...
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Table 4. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic (36) SPI INTERFACE CHARACTERISTICS Maximum Frequency of SPI Operation (37) Required Low ...
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ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS IN[0:3] High logic level Low logic level CS High logic level Low logic level V HS[0:3] V PWR V HS[0:3] 70% V PWR 30% V PWR I OCH 1 I OCH2 I OC1 Load I OC2 ...
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I OCH 1 I OCH2 I OC1 I OC2 I OC3 I OC4 I OCLO4 I OCLO3 I OCLO2 I OCLO1 RSTB RST 10% V 0.2 VDD TwRSTB t ENBL t W RST TENBL CS CSB 10% V 0.7VDD DD ...
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ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS 90% V 3.5V SCLK SCLK SO 0.2 VDD SO 10% V Low-to-High Low to High SO SO 90% V 0.7 VDD High to Low High-to-Low Figure 8. SCLK Waveform and Valid SO Data Delay Time 10XS3435 ...
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The 10XS3435 is one in a family of devices designed for low-voltage automotive lighting applications. Its four low R MOSFETs (dual 10mΩ, dual 35 mΩ) can control four DS(ON) separate 55W / 28W bulbs and/or Xenon modules. Programming, control and ...
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FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION GROUND (GND) These pins are the ground for the device. POSITIVE POWER SUPPLY (VPWR) This pin connects to the positive power supply and is the source of operational power for the device. The VPWR contact ...
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... FUNCTIONAL INTERNAL BLOCK DESCRIPTION MC10XS3435 - Functional Block Diagram MCU Interface & Output Control Parallel Control Inputs MCU Interface Supply POWER SUPPLY The 10XS3412B is designed to operate from 4.0V to 28V on the VPWR pin. Characteristics are provided from 6 20V for the device. The VPWR pin supplies power to internal regulator, analog, and logic circuit blocks ...
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FUNCTIONAL DEVICE OPERATION FUNCTIONAL INTERNAL BLOCK DESCRIPTION FUNCTIONAL DEVICE OPERATION SPI PROTOCOL DESCRIPTION The SPI interface has a full duplex, three-wire synchronous data transfer with four I/O lines associated with it: Serial Input (SI), Serial Output (SO), Serial Clock (SCLK), ...
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The 10XS3435 has four operating modes: Sleep, Normal, Fail-Safe and Fault. Table 5 and Figure 12 contained in succeeding paragraphs. The Figure 11 describes an internal signal called IN_ON[x] depending on IN[x] input. IN[x] IN_ON[x] Figure 11. IN_ON[x] internal signal ...
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FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES SLEEP MODE The 10XS3435 is in Sleep mode when: • V and V are within the normal voltage range, PWR DD • wake- • fail = X, • fault = X. This is ...
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command CALR ignored Internal clock duration In case of negative pulse is outside a predefined time CS range (from the calibration event will CSB(MIN) CSB(MAX) be ignored and the internal clock will be ...
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FUNCTIONAL DEVICE OPERATION PROTECTION AND DIAGNOSTIC FEATURES START-UP SEQUENCE The 10XS3435 enters in Normal mode after start-up if following sequence is provided: •VPWR and VDD power supplies must be above their under-voltage thresholds, •generate wake-up event (wake-up=1) from 0 to ...
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V SUPPLY(POR) 0. The SPI fault report (OC[0:3] bits) is removed after a read operation. In Normal mode using internal PWM module, the 10XS3435 incorporates also a cooling bulb filament management if OC_mode and Xenon are ...
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FUNCTIONAL DEVICE OPERATION PROTECTION AND DIAGNOSTIC FEATURES (OpenloadOFF=1 or ShortVpwr=1 (fault_control=1 and OV=0) or OV=1) OFF if hson=0 (fault_control=0 or OV=1) (fault_control=0) AUTO-RETRY The auto-retry circuitry is used to reactivate the output(s) automatically in case of over-current or over-temperature or ...
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Open-load Detection In On State The ON output open-load current thresholds can be chosen by SPI to detect a standard bulbs or LEDs (OLLED[0:3] bit set to logic [1]). In the case where load current drops below the defined current ...
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FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS SERIAL INPUT COMMUNICATION SPI communication is accomplished using 16-bit messages. A message is transmitted by the MCU starting with the MSB D15 and ending with the LSB, D0 Each incoming command message on ...
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ADDRESS A A 001— OUTPUT PWM CONTROL 1 0 REGISTER (PWMR_S ) The PWMR_s register allows the MCU to control the state of corresponding output through the SPI. Each output “s” is independently selected for configuration based on the state ...
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FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS A logic [1] on bit D8 (Xenon_s) disables enables the Xenon 55W or 28W bulb over-current profile, as described Figure 14. Xenon bit set to logic [0]: I OCH 1 I OCH2 I ...
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ADDRESS 00101 — GLOBAL CONFIGURATION REGISTER (GCR) The GCR register allows the MCU to configure the device through the SPI. Bit D8 allows the MCU to enable or disable the VDD failure detector. A logic [1] on VDD_FAIL_en bit allows ...
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FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS • Bits OD14:OD10 reflect the state of the bits SOA4 : SOA0 from the previously clocked in message. • Bit OD9 is set to logic [1] in Normal mode (NM). Table 22. Serial ...
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PREVIOUS ADDRESS SOA4 : SOA0 = A (OCR_S) The returned data contains the programmed values in the OCR register for the output selected with A PREVIOUS ADDRESS SOA4 : SOA0 = 00101 (GCR) The returned data contains the programmed values ...
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FUNCTIONAL DEVICE OPERATION TYPICAL APPLICATION The following figure shows a typical automotive lighting application (only one vehicle corner) using an external PWM clock from the main MCU. A redundancy circuitry has been V PWR Voltage regulator 10µF 100nF 100nF V ...
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The 10XS3435 is packaged in a surface mount power package intended to be soldered directly on the printed circuit board. The 10XS3435 was qualified in accordance with JEDEC standards J-STD-020C Sn-Pb reflow profile. The maximum For the most current package ...
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PACKAGING PACKAGE DIMENSIONS 10XS3435 42 PNA SUFFIX 24-PIN PQFN NONLEADED PACKAGE 98ARL10596D REV. D Analog Integrated Circuit Device Data Freescale Semiconductor ...
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Analog Integrated Circuit Device Data Freescale Semiconductor PNA SUFFIX 24-PIN PQFN NONLEADED PACKAGE 98ARL10596D REV. D PACKAGING PACKAGE DIMENSIONS 10XS3435 43 ...
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PACKAGING PACKAGE DIMENSIONS 10XS3435 44 PNA SUFFIX 24-PIN PQFN NONLEADED PACKAGE 98ARL10596D REV. D Analog Integrated Circuit Device Data Freescale Semiconductor ...
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ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 1.0) Introduction This thermal addendum is provided as a supplement to the 10XS3435 technical data sheet. The addendum provides thermal performance information that may be critical in the design and development of system applications. All ...
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... ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 1.0) 76.2mm Figure 17. 1s JEDEC Thermal Test Board Layout Transparent Top View MC10XS3435 Pin Connections 24-PIN PQFN (12 x 12) 0.9 mm Pitch 12.0mm 12.0mm Body 10XS3435 46 Figure 18. 2s2p JDEC Thermal Test Board (Red - Top Layer, Yellow - Two Buried Layers) ...
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Device on Thermal Test Board Material: Single layer printed circuit board FR4, 1.6 mm thickness Cu traces, 0.07 mm thickness Cu buried traces thickness 0.035mm Outline: 76.2mm x 114.3mm board area, including edge connector for thermal testing, 74mm x 74mm ...
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ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 1.0) 100 10 1 0.1 0.00001 Figure 21. Transient Thermal 1W Step Response; Device on 1s JEDEC Standard Thermal Test Board with Heat Spreading Areas 600 Sq. mm 100 10 1 0.1 0.00001 Figure 22. ...
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... Changed parameters for Wake Input Clamp Voltage in Static Electrical Characteristics Table on page 12. • Added explanation for recovering to Normal Mode on page 28. • Added HS[2:3] Driver Output Matching Time (t 12/2008 • Changed Orderable Part Number from PC10XS3435BPNA to MC10XS3435BPNA on Page 1. 6.0 Analog Integrated Circuit Device Data Freescale Semiconductor REVISION HISTORY ...
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... Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc., 2008. All rights reserved. ...