HSDL-3220-021 Lite-On Electronics, HSDL-3220-021 Datasheet

Infrared Transceivers IR Transceiver

HSDL-3220-021

Manufacturer Part Number
HSDL-3220-021
Description
Infrared Transceivers IR Transceiver
Manufacturer
Lite-On Electronics
Datasheet

Specifications of HSDL-3220-021

Wavelength
875 nm, 880 nm
Continual Data Transmission
4 Mbit/s
Transmission Distance
50 cm
Radiant Intensity
45 mW/sr
Half Intensity Angle Degrees
30 deg to 60 deg
Pulse Width
4 us, 1.6 us
Maximum Rise Time
60 ns, 600 ns
Maximum Fall Time
60 ns, 600 ns
Led Supply Voltage
0 V to 6.5 V
Maximum Forward Current
50 mA
Operating Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
- 25 C
Dimensions
8 mm x 3 mm x 2.5 mm
Data Rate
4Mbs (FIR)
Idle Current, Typ @ 25° C
1.8 mA
Link Range, Low Power
1m
Operating Temperature
-25°C ~ 70°C
Orientation
Side View
Shutdown
*
Size
8mm x 3mm x 2.5mm
Standards
IrPHY 1.4
Supply Voltage
2.7 V ~ 3.6 V
Lead Free Status / RoHS Status
Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Compliant
IrDA
Infrared Transceiver
Data Sheet
Description
The HSDL-3220 is a new generation low profile high
speed infrared transceiver module that provides inter-
face between logic and IR signals for through-air, serial,
half-duplex IR data-link. The module is fully compliant
to IrDA Physical Layer specification version 1.4 low
power from 9.6kbit/s to 4.0 Mbit/s (FIR) and is IEC825-
Class 1 Eye Safe.
The HSDL-3220 can be shutdown completely to achieve
very low power consumption. In the shutdown mode,
the PIN diode will be inactive and thus producing very
little photocurrent even under very bright ambient
light. It is also designed to interface to input/output
logic circuits as low as 1.8V. These features are ideal for
mobile devices that require low power consumption.
V
Figure 1. Functional block diagram of HSDL-3220.
Figure 2. Rear view diagram with pinout.
led
8
®
R1
CX3
Data Compliant Low Power 4.0 Mbit/s
7
SD (5)
RXD (4)
TXD (3)
LED C (2)
LED A (1)
6
IOV
CX4
5
CC
(7)
4
V
3
CC
V
(6)
CC
HSDL-3220
2
TRANSMITTER
CX2
CX1
1
GND (8)
Features
• Fully compliant to IrDA 1.4 physical layer low power
• Miniature package
• Typical link distance > 50 cm
• Guaranteed temperature performance, -25
• Critical parameters are guaranteed over temperature
• Low power consumption
• Excellent EMI performance
• Vcc supply 2.7 to 3.6 Volts
• Interfacing with I/O logic circuits as low as 1.8 V
• Lead-free package
• LED stuck-high protection
• Designed to accommodate light loss with cosmetic
• IEC 825-class 1 eye safe
Applications
• Mobile telecom
• Data communication
• Digital imaging
• Electronic wallet
• Small industrial & medical instrumentation
specification from 9.6 kbit/s to 4.0 Mbit/s (FIR)
– Height: 2.5 mm
– Width: 8.0 mm
– Depth: 3.0 mm
and supply voltage
– Low shutdown current
– Complete shutdown of TXD, RXD and PIN diode
windows
– Mobile phones
– Smart phones
– Pagers
– Digital cameras
– Photo-imaging printers
– General data collection devices
– Patient & pharmaceutical data collection devices
– Personal digital assistants
– Portable printers
– Pocket PC handheld products
o
to 70
o
C

Related parts for HSDL-3220-021

HSDL-3220-021 Summary of contents

Page 1

... Infrared Transceiver Data Sheet Description The HSDL-3220 is a new generation low profile high speed infrared transceiver module that provides inter- face between logic and IR signals for through-air, serial, half-duplex IR data-link. The module is fully compliant to IrDA Physical Layer specification version 1.4 low power from 9 ...

Page 2

... HSDL-3220 infrared transceiver module. You can con- tact them through your local sales representatives for additional details. Order Information Part Number Packaging Type HSDL-3220-021 Tape and Reel I/O Pins Configuration Table Pin Symbol 1 LED A ...

Page 3

Bandwidth Selection Timing The transceiver is in default SIR/ MIR mode when pow- ered on. User needs to apply the following program- ming sequence to both the SD and TXD inputs to en- able the transceiver to operate at FIR ...

Page 4

Absolute Maximum Ratings For implementations where case to ambient thermal resistance is ≤50°C/W. Parameter S torage Temperature Operating Temperature LED Anode Voltage Supply Voltage Input Voltage: TXD, SD/Mode Output Voltage: RXD DC LED Transmit Current Average Transmit Current Recommended Operating ...

Page 5

Electrical and Optical Specifications Specifications (Min. and Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25°C, Vcc set to 3.0V and ...

Page 6

V OH 90% 50% 10 Figure 5. RxD output waveform. TXD LED t pw (MAX.) Figure 7. TxD “Stuck On” protection waveform. 120 100 0.10 0.15 0.20 0.25 I ...

Page 7

... HSDL-3220 Package Dimensions 7 ...

Page 8

... HSDL-3220 Tape and Reel Dimensions Unit: mm Ø1.5 POLARITY Pin 8: VLED Pin 1: GND 8.4 ± 0.1 0.4 ± 0.05 3.4 ± 0.1 2.8 ± 0.1 Empty Parts Mounted (40 mm min) LABEL Note: The carrier tape is compliant to the packaging materials standards for ESD sensitive device, EIA-541 8 4.0 ± ...

Page 9

... Moisture Proof Packaging All HSDL-3220 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 4. UNITS IN A SEALED MOISTURE-PROOF PACKAGE PACKAGE IS OPENED (UNSEALED) ENVIRONMENT LESS THAN 30°C, AND LESS THAN 60% RH YES PACKAGE IS NO BAKING ...

Page 10

... The ∆T/∆time rates are detailed in the above table. The temperatures are measured at the com- ponent to printed circuit board connections. In process zone P1, the PC board and HSDL-3220 cas- tellation pins are heated to a temperature of 160°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4° ...

Page 11

Appendix A: SMT Assembly Application Note Solder Pad, Mask and Metal Stencil Aperture STENCIL APERTURE SOLDER MASK Figure 12. Stencil and PCBA. Recommended Land Pattern C L 1.35 MOUNTING CENTER 0.10 1.75 0.60 0.475 1.425 UNIT: mm Figure 13. Stencil ...

Page 12

Recommended Metal Solder Stencil Aperture It is recommended that only a 0.152 mm (0.006 inches 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no ...

Page 13

Appendix B: PCB Layout Suggestion The following PCB layout guidelines should be followed to obtain a good PSRR and EM immunity resulting in good electrical performance. Things to note: 1. The ground plane should be continuous under the part, but ...

Page 14

... USER INTERFACE Figure 17. Mobile phone platform. 14 Interface to Recommended I/O chips The HSDL-3220’s TXD data input is buffered to allow for CMOS drive levels. No peaking circuit or capacitor is required. Data rate from 9.6 kbit 4.0 Mbit/s is available at the RXD pin. The block diagram below shows how the IR port fits into a mobile phone and PDA platform ...

Page 15

... ROM PCMCIA Controller RS232C Driver PDA Platform Figure 18. PDA platform. The link distance testing was done using typical HSDL- 3220 units with SMC’s FDC37C669 and FDC37N769 Super I/O controllers link distance was demonstrated for SIR and FIR speeds. 15 LCD Panel ...

Page 16

... The depth of the LED image inside the HSDL-3220 3.17 mm. ‘A’ is the required half angle for viewing. For IrDA compliance, the minimum is 15° and the maximum is 30° ...

Page 17

Module Depth (z) mm APERTURE WIDTH (X) vs. MODULE DEPTH MODULE DEPTH (Z) – mm Figure ...

Page 18

Shape of the Window From an optics standpoint, the window should be flat. This ensures that the window will not alter either the radiation pattern of the LED, or the receive pattern of the photodiode. If the window must be ...

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