5962-8981703XA QP SEMICONDUCTOR, 5962-8981703XA Datasheet - Page 10

• Manufacturer Part Number: 5962-8981703XA
• Manufacturer: QP SEMICONDUCTOR

Specifications of 5962-8981703XA

• Organization: 32Kx8
• Interface Type: Parallel
• In System Programmable: In System/External
• Access Time (max): 35ns
• Package Type: CDIP
• Reprogramming Technique: UV
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (min): 4.5V
• Operating Supply Voltage (max): 5.5V
• Supply Current: 130mA
• Pin Count: 28
• Mounting: Through Hole
• Operating Temp Range: -55C to 125C
• Operating Temperature Classification: Military
• Lead Free Status / RoHS Status: Not Compliant

DSCC FORM 2234
APR 97
listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD
PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification
mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used.
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-
38535, appendix A and the requirements herein.
with each lot of microcircuits delivered to this drawing.
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
manufacturer prior to delivery.
characteristics specified in 4.4.
procedures and characteristics specified in 4.5.
programmed to the specified pattern or erased. As a minimum, verification shall consist of performing a functional test
(subgroup 7) to verify that all cells are in the proper state. Any cell that does not verify to be in the proper state shall constitute
a device failure, and shall be removed from the lot.
appendix A.
devices prior to quality conformance inspection. The following additional criteria shall apply:
3.10 Processing EPROMs. All testing requirements and quality assurance provisions herein shall be satisfied by the
3.10.1
3.10.2 Programmability of EPROMs. When specified, devices shall be programmed to the specified pattern using the
3.10.3
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all
a. Burn-in test, method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
c. A data retention stress test shall be included as part of the screening procedure and shall consist of the following
(1)
(2) T
tests prior to burn-in are optional at the discretion of the manufacturer.
steps: (Steps 1 through 4 may be performed at the wafer level. The maximum storage temperature shall not exceed
200°C for packaged devices or 300°C for unassembled devices.)
DEFENSE SUPPLY CENTER COLUMBUS
Verification of erasure of programmability of EPROMs.
Erasure of EPROMs.
Test condition D. The test circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to the preparing activity upon request. The test circuit shall specify the inputs, outputs,
biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-
883.
A
MICROCIRCUIT DRAWING
COLUMBUS, OHIO 43218-3990
= +125°C, minimum.
STANDARD
When specified, devices shall be erased in accordance with the procedures and
SIZE
A
When specified, devices shall be verified as either
REVISION LEVEL
C
SHEET
5962-89817
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