W9751G6JB-3 Winbond, W9751G6JB-3 Datasheet - Page 85

• Manufacturer Part Number: W9751G6JB-3
• Manufacturer: Winbond
• Type: DDR2 SDRAMr

Specifications of W9751G6JB-3

• Organization: 32Mx16
• Density: 512Mb
• Address Bus: 14b
• Access Time (max): 450ps
• Maximum Clock Rate: 667MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: WBGA
• Operating Temp Range: 0C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 150mA
• Pin Count: 84
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Compliant

11. PACKAGE SPECIFICATION
Package Outline WBGA-84 (8x12.5 mm
SOLDER BALL DIAMETER REFERS.
TO POST REFLOW CONDITION.
84xψb
9
eE
8
7
SYMBOL
aaa
bbb
ccc
D1
eD
A1
E1
eE
A
D
E
b
E1
THE WINDOW-SIDE
ENCAPSULANT
12.40
MIN.
3
0.25
0.40
7.90
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DIMENSION (MM)
2
11.20 BSC.
6.40 BSC.
0.80 BSC.
0.80 BSC.
1
12.50
NOM.
8.00
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---
---
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PIN A1 INDEX
A
B
C
D
E
F
G
H
K
L
N
P
R
J
M
12.60
A1
MAX.
0.20
0.10
1.20
0.40
0.50
8.10
0.15
SEATING PLANE
C
2
A
)
- 85 -
ccc
//
C
PIN A1 INDEX
bbb
C
A
Note: 1. Ball land : 0.5mm
Publication Release Date: Jun. 18, 2010
2. Ball opening : 0.4mm
3. PCB Ball land suggested
Ball Opening
Ball Land
E
W9751G6JB
Revision A03
0.4mm
B
aaa
C
4X