MT47H64M8CF-3:F Micron Technology Inc, MT47H64M8CF-3:F Datasheet - Page 18

• Manufacturer Part Number: MT47H64M8CF-3:F
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H64M8CF-3:F

• Organization: 64Mx8
• Density: 512Mb
• Address Bus: 16b
• Access Time (max): 450ps
• Maximum Clock Rate: 667MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: 0C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 180mA
• Pin Count: 60
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Compliant

Packaging
Package Dimensions
Figure 8: 84-Ball FBGA (8mm x 12.5mm) – x16
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. R 12/10 EN
Solder ball material:
SAC305
3% Ag, 0.5% Cu)
Dimensions apply to
solder balls post-reflow
on Ø0.35 SMD
ball pads.
Seating
84X Ø0.45
plane
0.12 A
(96.5% Sn,
11.2 CTR
0.8 TYP
.
Notes:
A
Nonconductive overmold
9 8
1. All dimensions are in millimeters.
2. Solder ball material for this package is also available as leaded eutectic (62% Sn, 36%
Pb, 2% Ag).
7
1.8 CTR
6.4 CTR
TYP
8 ±0.1
0.8
3 2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
18
Ball A1 ID
12.5 ±0.1
0.8 ±0.05
0.155
Micron Technology, Inc. reserves the right to change products or specifications without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.2 MAX
© 2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging