S71NS128NB0BJWRN0 Spansion Inc., S71NS128NB0BJWRN0 Datasheet - Page 12
S71NS128NB0BJWRN0
Manufacturer Part Number
S71NS128NB0BJWRN0
Description
Manufacturer
Spansion Inc.
Datasheet
1.S71NS128NB0BJWRN0.pdf
(14 pages)
Specifications of S71NS128NB0BJWRN0
Operating Supply Voltage (max)
1.95V
Operating Temperature (max)
85C
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant
12
4.3.2
NLA060—11.0 x 10.0 mm, 60-ball VFBGA
PACKAGE
SYMBOL
SD / SE
JEDEC
D x E
MD
ME
Øb
A1
A2
D1
E1
eE
eD
D
A
E
n
A A2
CORNER
0.15 C
(2X)
PIN A1
F1,F2,F3,F4,F15,F16,F17,F18,G1,G2,G3,G4,G15,G16,G17,G18
H1,H2,H3,H4,H15,H16,H17,H18,J1,J2,J3,J4,J15,J16,J17,J18
D1~D18,E1,E2,E3,E4,E7,E8,E11,E12,E15,E16,E17,E18
0.20
0.85
0.25
MIN
L1 ~L18,M1,M2,M4~M15,M17,M18,N1~N18,P2~P17
---
K1,K2,K3,K4,K7,K8,K11,K12,K15,K16,K17,K18
A2~A17,B1~B18,C1,C2,C4~C15,C17,C18
10.95 mm x 9.95 mm
A1
60X
0.15
0.08
10.95 BSC.
PACKAGE
9.95 BSC.
6.50 BSC.
8.50 BSC.
0.50 BSC.
0.25 BSC.
0.50 BSC
NLA 060
INDEX MARK
NOM
0.30
N/A
---
---
---
14
18
60
6
M C
M C
b
9
D a t a
A B
MAX
1.20
0.97
0.35
SIDE VIEW
---
TOP VIEW
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S h e e t
S71NS-N MCP Products
Figure 4.5 NLA060—60-ball VFBGA
NOTE
( A d v a n c e
C
A
0.15
(2X)
E
B
C
0.20
0.08
eE
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
10. OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.
C
C
18
17
16
15
14
13
12
11
10
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JEP95, SECTION 4.3,
SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
9
8
7
6
5
4
3
2
1
I n f o r m a t i o n )
e REPRESENTS THE SOLDER BALL GRID PITCH.
eD
P N M L K J H G F E D C B
SD
BOTTOM VIEW
7
D1
S71NS-N_00_A9 April 15, 2009
A
3483 \ 16-038.22 \ 3.11.5
SE
CORNER
PIN A1
7
E1