MT29C2G48MAKLCJA-6 IT Micron Technology Inc, MT29C2G48MAKLCJA-6 IT Datasheet - Page 14

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MT29C2G48MAKLCJA-6 IT

Manufacturer Part Number
MT29C2G48MAKLCJA-6 IT
Description
Combo Mem 128Mx16 Flash + 128Mx16 LPSDRAM 1.8V Tray
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT29C2G48MAKLCJA-6 IT

Organization
128Mx16 Flash + 128Mx16 LPSDRAM
Operating Supply Voltage
1.8 V
Operating Temperature
-40 to 85 °C
Lead Free Status / Rohs Status
Compliant
Figure 8: 168-Ball VFBGA (Package Code: JI)
PDF: 09005aef83070ff3
168ball_nand_lpdram_j4xx_omap.pdf - Rev. I 6/09
Solder ball
material: SAC105.
Dimensions apply
to solder balls post-
reflow on Ø0.27
SMD ball pads.
168X Ø0.33
Seating
11 CTR
plane
0.08 A
0.5 TYP
A
23
Note:
22
21
20
19
18 1716 151413 121110 9 8 7 6 5 4 3 2 1
1. All dimensions are in millimeters.
12 ±0.1
11 CTR
Ball A1 ID
168-Ball NAND Flash and LPDRAM PoP (TI OMAP) MCP
0.5 TYP
14
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
0.75 ±0.1
12 ±0.1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.25 MIN
1.1 MAX
Ball A1 ID
Package Dimensions
©2007 Micron Technology, Inc. All rights reserved.

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