UPC2758TB NEC, UPC2758TB Datasheet - Page 16

• Manufacturer Part Number: UPC2758TB
• Description: Up-Down Converters 3V Downconverter
• Manufacturer: NEC

Specifications of UPC2758TB

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

15. NOTE ON CORRECT USE
(1) Observe precautions for handling because of electrostatic sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Connect a bypass capacitor (example: 1 000 pF) to the V
(4) The DC cut capacitor must be attached to input pin.
16. RECOMMENDED SOLDERING CONDITIONS
conditions other than those recommended below, contact your NEC sales representative.
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
16
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Soldering Method
This product should be soldered under the following recommended conditions.
Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
Keep the track length of the ground pins as short as possible.
Package peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Count: 3, Exposure limit: None
Package peak temperature: 215°C or below
Time: 40 seconds or less (at 200°C)
Count: 3, Exposure limit: None
Soldering bath temperature: 260°C or below
Time: 10 seconds or less
Count: 1, Exposure limit: None
Pin temperature: 300°C
Time: 3 seconds or less (per side of device)
Exposure limit: None
Note
Soldering Condition
Data Sheet P12771EJ3V0DS00
Note
Note
Note
CC
pin.
PC2757TB,
Recommended Condition Symbol
For soldering methods and
WS60-00-1
VP15-00-3
IR35-00-3
–
PC2758TB