PBLS6005D,115 NXP Semiconductors, PBLS6005D,115 Datasheet - Page 13

• Manufacturer Part Number: PBLS6005D,115
• Description: LOADSWITCH PNP 60V 1A SOT457
• Manufacturer: NXP Semiconductors
• Series: -r

Specifications of PBLS6005D,115

• Package / Case: SC-74-6
• Transistor Type: 1 NPN Pre-Biased, 1 PNP
• Current - Collector (ic) (max): 100mA, 700mA
• Voltage - Collector Emitter Breakdown (max): 50V, 60V
• Resistor - Base (r1) (ohms): 47K
• Resistor - Emitter Base (r2) (ohms): 47K
• Dc Current Gain (hfe) (min) @ Ic, Vce: 80 @ 5mA, 5V / 150 @ 500mA, 5V
• Vce Saturation (max) @ Ib, Ic: 150mV @ 500µA, 10mA / 340mV @ 100mA, 1A
• Current - Collector Cutoff (max): 1µA, 100nA
• Frequency - Transition: 185MHz
• Power - Max: 600mW
• Mounting Type: Surface Mount
• Configuration: Dual
• Transistor Polarity: NPN/PNP
• Typical Input Resistor: 47 KOhms at NPN
• Typical Resistor Ratio: 1 at NPN
• Mounting Style: SMD/SMT
• Collector- Emitter Voltage Vceo Max: 50 V at NPN, 60 V at PNP
• Peak Dc Collector Current: 100 mA at NPN, 1000 mA at PNP
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 934059337115; PBLS6005D T/R; PBLS6005D T/R

NXP Semiconductors
11. Soldering
PBLS6005D_2
Product data sheet
Fig 20. Reflow soldering footprint
Fig 21. Wave soldering footprint
5.05
3.30
Dimensions in mm
Dimensions in mm
2.825
0.95
Rev. 02 — 7 September 2009
5.30
1.40
4.30
3.45
1.95
1.60
1.70
3.10
3.20
msc422
0.45 0.55
0.45
1.45 4.45
msc423
60 V PNP BISS loadswitch
PBLS6005D
© NXP B.V. 2009. All rights reserved.
solder lands
solder resist
occupied area
solder paste
solder lands
solder resist
occupied area
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