BF1211,215 NXP Semiconductors, BF1211,215 Datasheet - Page 3

• Manufacturer Part Number: BF1211,215
• Description: MOSFET N-CH DUAL GATE 6V SOT143B
• Manufacturer: NXP Semiconductors

Specifications of BF1211,215

• Package / Case: SOT-143, SOT-143B, TO-253AA
• Transistor Type: N-Channel Dual Gate
• Frequency: 400MHz
• Gain: 29dB
• Voltage - Rated: 6V
• Current Rating: 30mA
• Noise Figure: 0.9dB
• Current - Test: 15mA
• Voltage - Test: 5V
• Configuration: Single Dual Gate
• Continuous Drain Current: 0.03 A
• Drain-source Breakdown Voltage: 6 V
• Gate-source Breakdown Voltage: 6 V
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Power Dissipation: 180 mW
• Transistor Polarity: N-Channel
• Application: VHF/UHF
• Channel Type: N
• Channel Mode: Enhancement
• Drain Source Voltage (max): 6V
• Power Gain (typ)@vds: 34@5VdB
• Noise Figure (max): 2dB
• Package Type: SOT
• Pin Count: 3 +Tab
• Input Capacitance (typ)@vds: 2.1@5V@Gate 1/1.1@5V@Gate 2pF
• Output Capacitance (typ)@vds: 0.9@5VpF
• Reverse Capacitance (typ): 0.015@5VpF
• Operating Temp Range: -65C to 150C
• Mounting: Surface Mount
• Number Of Elements: 2
• Power Dissipation (max): 180mW
• Screening Level: Military
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-1959-2; 934057516215; BF1211

NXP Semiconductors
ORDERING INFORMATION
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Note
1. T
THERMAL CHARACTERISTICS
2003 Dec 16
BF1211
BF1211R
BF1211WR
V
I
I
I
P
T
T
R
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport
and handling.
SYMBOL
D
G1
G2
SYMBOL
TYPE NUMBER
stg
j
DS
tot
N-channel dual-gate MOS-FETs
th(j-s)
s
is the temperature of the soldering point of the source lead.
drain-source voltage
drain current (DC)
gate 1 current
gate 2 current
total power dissipation
storage temperature
junction temperature
thermal resistance from junction to soldering point
BF1211; BF1211R
BF1211WR
BF1211; BF1211R
BF1211WR
NAME
PARAMETER



plastic surface mounted package; 4 leads
plastic surface mounted package; reverse pinning; 4 leads
plastic surface mounted package; reverse pinning; 4 leads
PARAMETER
CAUTION
T
T
s
s
 116 C; note 1
 122 C; note 1
3
DESCRIPTION
CONDITIONS
PACKAGE
BF1211; BF1211R; BF1211WR






65

MIN.
VALUE
185
155
6
30
10
10
180
180
+150
150
Product specification
MAX.
VERSION
SOT143B
SOT143R
SOT343R
UNIT
K/W
K/W
V
mA
mA
mA
mW
mW
C
C
UNIT