BAV99LT1G ON Semiconductor, BAV99LT1G Datasheet

DIODE SWITCH SS DUAL 70V SOT23

BAV99LT1G

Manufacturer Part Number
BAV99LT1G
Description
DIODE SWITCH SS DUAL 70V SOT23
Manufacturer
ON Semiconductor
Datasheets

Specifications of BAV99LT1G

Voltage - Forward (vf) (max) @ If
1.25V @ 150mA
Current - Reverse Leakage @ Vr
2.5µA @ 70V
Current - Average Rectified (io) (per Diode)
215mA (DC)
Voltage - Dc Reverse (vr) (max)
70V
Reverse Recovery Time (trr)
6ns
Diode Type
Standard
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Diode Configuration
1 Pair Series Connection
Mounting Type
Surface Mount
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Capacitance, Junction
1.5 pF
Configuration
Dual
Current, Forward
215 mA
Current, Surge
500 mA
Package Type
SOT-23 (TO-236)
Power Dissipation
225 mW
Primary Type
Rectifier
Speed, Switching
Switching
Temperature, Junction, Maximum
+150 °C
Temperature, Operating
-60 to +150 °C
Time, Recovery
6 ns
Voltage, Forward
1250 mV
Voltage, Reverse
70 V
Rectifier Type
Small Signal Switching Diode
Peak Rep Rev Volt
70V
Avg. Forward Curr (max)
0.715A
Rev Curr
2.5uA
Peak Non-repetitive Surge Current (max)
2A
Forward Voltage
1.25V
Operating Temp Range
-65C to 150C
Rev Recov Time
6ns
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BAV99LT1GOSTR

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BAV99LT1G
Dual Series
Switching Diode
Features
1. FR−5 = 1.0  0.75  0.062 in.
2. Alumina = 0.4  0.3  0.024 in 99.5% alumina.
MAXIMUM RATINGS
© Semiconductor Components Industries, LLC, 2010
December, 2010 − Rev. 7
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Reverse Voltage
Forward Current
Peak Forward Surge Current
Repetitive Peak Reverse Voltage
Average Rectified Forward Current (Note 1)
Repetitive Peak Forward Current
Non−Repetitive Peak Forward Current
Total Device Dissipation
Thermal Resistance, Junction−to−Ambient
Total Device Dissipation
Thermal Resistance, Junction−to−Ambient
Junction and Storage
Compliant
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
(averaged over any 20 ms period)
t = 1.0 ms
t = 1.0 ms
t = 1.0 s
FR−5 Board (Note 1) T
Derate above 25°C
Alumina Substrate (Note 2)
T
Derate above 25°C
Temperature Range
A
= 25°C
Characteristic
Rating
(Each Diode)
A
= 25°C
I
Symbol
Symbol
FM(surge)
T
V
I
R
R
I
I
J
F(AV)
FRM
FSM
V
P
P
RRM
, T
I
qJA
qJA
F
R
D
D
stg
−65 to
Value
+150
Max
215
500
715
450
225
556
300
417
2.0
1.0
0.5
1.8
2.4
70
70
1
mW/°C
mW/°C
mAdc
mAdc
°C/W
°C/W
Unit
Unit
Vdc
mW
mW
mA
mA
°C
V
A
BAV99LT1G
†For information on tape and reel specifications,
BAV99LT3G
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*Date Code orientation and/or overbar may
Device
vary depending upon manufacturing location.
(Note: Microdot may be in either location)
ANODE
1
ORDERING INFORMATION
1
A7 = Device Code
M
G
MARKING DIAGRAM
2
http://onsemi.com
CATHODE/ANODE
(Pb−Free)
(Pb−Free)
1
Package
= Date Code*
= Pb−Free Package
SOT−23
SOT−23
3
A7 MG
3
G
Publication Order Number:
CASE 318
STYLE 11
10,000/Tape & Reel
3000/Tape & Reel
SOT−23
CATHODE
Shipping
2
BAV99LT1/D

Related parts for BAV99LT1G

BAV99LT1G Summary of contents

Page 1

... P 225 mW D 1.8 mW/°C R 556 °C/W qJA P 300 mW D 2.4 mW/°C BAV99LT1G R 417 °C/W qJA BAV99LT3G −65 to °C J stg +150 †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. ...

Page 2

OFF CHARACTERISTICS (T = 25°C unless otherwise noted) (Each Diode) A Characteristic Reverse Breakdown Voltage 100 mA) (BR) Reverse Voltage Leakage Current Vdc Vdc Vdc, T ...

Page 3

... A A1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...

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