MT9V125IA7XTC Aptina LLC, MT9V125IA7XTC Datasheet - Page 19

• Manufacturer Part Number: MT9V125IA7XTC
• Description: SENSOR IMAGE VGA COLOR 52IBGA
• Manufacturer: Aptina LLC
• Series: DigitalClarity®, Micron®r
• Type: CMOS Imagingr

Specifications of MT9V125IA7XTC

• Package / Case: 52-IBGA
• Pixel Size: 5.6µm x 5.6µm
• Active Pixel Array: 640H x 480V
• Frames Per Second: 25 ~ 30
• Voltage - Supply: 2.5 V ~ 3.1 V
• Supply Voltage Range: 2.5V To 3.1V
• Operating Temperature Range: -40°C To +105°C
• Digital Ic Case Style: BGA
• No. Of Pins: 52
• Supply Voltage Max: 3.1V
• Supply Voltage Min: 2.5V
• Ic Function: System-On-A-Chip (SOC) CMOS Digital Image Sensor
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 557-1240 - KIT HEADBOARD FOR MT9V125557-1239 - KIT DEMO FOR MT9V125
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 557-1238

Package and Die Dimensions
Figure 11:
PDF: 09005aef829db8a0/Source: 09005aef829dbfdb
MT9V125_LDS_3.fm - Rev. A 4/07 EN
Seating
plane
0.10 A
Dimensions apply
to solder balls post-
reflow. The pre-
reflow diameter is
Ø0.50 on a Ø0.40
SMD ball pad.
7.00
52X Ø0.55
1.00 typ
3.50
Micron, the M logo, the Micron logo, and DigitalClarity are trademarks of Micron Technology, Inc.
A
D
52-Ball iBGA Package Outline Drawing
Notes:
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
3.50
Solder ball material: 96.5% Sn, 3% Ag, 0.5% Cu
Ball A8
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
9.000 ±0.075
1. All dimensions in millimeters.
All other trademarks are the property of their respective owners.
1.00 TYP
7.00
C L
Substrate material: plastic laminate
(For reference only)
Encapsulant: epoxy
0.40
Ball A1
C L
Ball A1 ID
B
9.000 ±0.075
C
MT9V125: 1/4-Inch VGA SOC Digital Image Sensor
0.90
19
®
0.375 ±0.050
0.125
(For reference only)
Maximum rotation of optical area relative to package edges: 1º
Maximum tilt of optical area relative to package edge
Maximum tilt of optical area relative to top of cover glass: 50 microns
Lid material: borosilicate glass 0.40 thickness
Image sensor die
0.525 ±0.050
Optical area
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Fuses
5.20
1.845
C L
Package and Die Dimensions
Ø0.15 A B C
3.584 CTR
5.50 CTR
C L
©2007 Micron Technology, Inc. All rights reserved.
D
Optical
center
: 50 microns
2.688 CTR
First
clear
pixel
Ø0.15 A
C
B