CY7C1347G-200AXC Cypress Semiconductor Corp, CY7C1347G-200AXC Datasheet - Page 13

SRAM (Static RAM)

CY7C1347G-200AXC

Manufacturer Part Number
CY7C1347G-200AXC
Description
SRAM (Static RAM)
Manufacturer
Cypress Semiconductor Corp
Datasheets

Specifications of CY7C1347G-200AXC

Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
4.5M (128K x 36)
Speed
200MHz
Interface
Parallel
Voltage - Supply
3.15 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
100-LQFP
Density
4.5Mb
Access Time (max)
2.8ns
Sync/async
Synchronous
Architecture
SDR
Clock Freq (max)
200MHz
Operating Supply Voltage (typ)
3.3V
Address Bus
17b
Package Type
TQFP
Operating Temp Range
0C to 70C
Number Of Ports
4
Supply Current
265mA
Operating Supply Voltage (min)
3.135V
Operating Supply Voltage (max)
3.6V
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
100
Word Size
36b
Number Of Words
128K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
428-2115
CY7C1347G-200AXC

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1347G-200AXC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Part Number:
CY7C1347G-200AXC
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Company:
Part Number:
CY7C1347G-200AXC
Quantity:
360
Part Number:
CY7C1347G-200AXCT
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Capacitance
Tested initially and after any design or process changes that may affect these parameters.
Thermal Resistance
Tested initially and after any design or process changes that may affect these parameters.
Document #: 38-05516 Rev. *I
C
C
C
Parameter
Parameter
IN
CLK
IO
OUTPUT
OUTPUT
3.3 V I/O Test Load
JA
JC
2.5 V I/O Test Load
Input capacitance
Clock input capacitance
I/O capacitance
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to case)
Z
Z
0
0
= 50 
= 50 
Description
Description
V
(a)
(a)
V
T
T
= 1.5 V
= 1.25 V
R
R
L
L
= 50 
= 50 
T
V
V
Test conditions follow standard
test methods and procedures for
measuring thermal impedance,
per EIA/JESD51.
OUTPUT
OUTPUT
A
DD
DDQ
3.3 V
2.5 V
= 25 C, f = 1 MHz,
Figure 4. AC Test Loads and Waveforms
= 3.3 V.
= 3.3 V
Including
JIG and
Test Conditions
Test Conditions
Including
scope
JIG and
scope
5 pF
5 pF
(b)
(b)
R = 317 
R = 1667 
R = 351 
R = 1538 
100-pin TQFP
100-pin TQFP
Package
V
30.32
GND
GND
6.85
DDQ
V
Max
DDQ
5
5
5
 1 ns
 1 ns
10%
10%
119-ball BGA
119-ball BGA
Package
34.1
14.0
Max
All input pulses
All input pulses
90%
90%
5
5
7
(c)
(c)
165-ball FBGA
165-ball FBGA
Package
CY7C1347G
20.3
Max
4.6
5
5
7
90%
90%
Page 13 of 24
10%
10%
 1 ns
 1 ns
C/W
C/W
Unit
Unit
pF
pF
pF
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