S29AL008D70TFI020 Spansion Inc., S29AL008D70TFI020 Datasheet - Page 50

• Manufacturer Part Number: S29AL008D70TFI020
• Description: Flash Memory IC
• Manufacturer: Spansion Inc.

Specifications of S29AL008D70TFI020

• Memory Size: 8Mbit
• Memory Configuration: 1M X 8 / 512K X 16
• Ic Interface Type: Parallel
• Access Time: 70ns
• Memory Case Style: TSOP
• No. Of Pins: 48
• Operating Temperature Range: -40°C To +85°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

2. Under worst case conditions of 90°C, V
3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most
4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.
5. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program
6. The device has a guaranteed minimum erase and program cycle endurance of 1,000,000 cycles.
Includes all pins except V
Notes:
1. Sampled, not 100% tested.
2. Test conditions T
50
Input voltage with respect to V
(including A9, OE#, and RESET#)
Input voltage with respect to V
V
CC
bytes program faster than the maximum program times listed.
command. See
Parameter
Current
Symbol
C
C
C
OUT
IN2
IN
Table 5, on page 25
A
= 25°C, f = 1.0 MHz.
CC
Description
Parameter Description
. Test conditions: V
Control Pin Capacitance
Output Capacitance
SS
SS
Input Capacitance
Table 14. TSOP, SO, and BGA Pin Capacitance
on all pins except I/O pins
on all I/O pins
for further information on command definitions.
Table 13. Latchup Characteristics
CC
= 2.7 V, 1,000,000 cycles.
CC
D a t a
= 3.0 V, one pin at a time.
S29AL008D
S h e e t
Test Setup
V
V
V
OUT
IN
IN
= 0
= 0
= 0
–100 mA
–1.0 V
–1.0 V
Min
Package
TSOP, SO
TSOP, SO
TSOP, SO
BGA
BGA
BGA
Typ
4.2
8.5
5.4
7.5
3.9
6
S29AL008D_00A3 June 16, 2005
V
+100 mA
CC
12.5 V
Max
7.5
5.0
6.5
4.7
Max
12
+ 1.0 V
9
Unit
pF