S29AL008D70TFI020 Spansion Inc., S29AL008D70TFI020 Datasheet - Page 10

• Manufacturer Part Number: S29AL008D70TFI020
• Description: Flash Memory IC
• Manufacturer: Spansion Inc.

Specifications of S29AL008D70TFI020

• Memory Size: 8Mbit
• Memory Configuration: 1M X 8 / 512K X 16
• Ic Interface Type: Parallel
• Access Time: 70ns
• Memory Case Style: TSOP
• No. Of Pins: 48
• Operating Temperature Range: -40°C To +85°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Ordering Information
Notes:
1.
2.
3.
4.
10
S29AL008D
Device Number
Type 0 is standard. Specify other options as required.
Type 1 is standard. Specify other options as required.
TSOP and SOP package markings omit packing type designator from ordering part number.
BGA package marking omits leading S29 and packing type designator from ordering part number.
S29AL008D
Standard Products
Valid Combinations list configurations planned to be supported in volume for this device. Consult
your local sales office to confirm availability of specific valid combinations and to check on newly
released combinations.
Spansion standard products are available in several packages and operating
ranges. The order number (Valid Combination) is formed by a combination of the
elements below.
55
DEVICE NUMBER/DESCRIPTION
S29AL008D
8 Megabit Flash Memory manufactured using 200 nm process technology
3.0 Volt-only Read, Program, and Erase
Option
Speed
70, 90
70, 90
70, 90
T
55
55
55
S29AL008D Valid Combinations
A
I
Temperature Range
MAI, MFI, MAN, MFN
TAI, TFI, TAN, TFN
BAI, BF, BAN, BFN
Package Type,
Material, and
RI
MAI, MFI
BAI, BFI
TAI, TFI
0
Valid Combinations
D a t a
PACKING TYPE
0
1
2
3
MODEL NUMBER
01
R1
02
R2
TEMPERATURE RANGE
I
N
PACKAGE MATERIAL SET
A
F
PACKAGE TYPE
T
B
M
SPEED OPTION
55
70
90
S29AL008D
= Tray
= Tube
= 7” Tape and Reel
= 13” Tape and Reel
= x8/x16, V
= x8/x16, V
= x8/x16, V
= x8/x16, V
= Industrial (-40
= Extended (-40°C to +125°C)
= Standard
= Pb-Free
= Thin Small Outline Package (TSOP) Standard Pinout
= Fine-pitch Ball-Grid Array Package
= Small Outline Package (SOP) Standard Pinout
= 55 ns Access Speed
= 70 ns Access Speed
= 90 ns Access Speed
Number
R1, R2
Model
R1, R2
01, 02
01, 02
R1, R2
01, 02
S h e e t
CC
CC
CC
CC
= 2.7 - 3.6V, top boot sector device
= 3.0 - 3.6V. top boot sector device
= 2.7 - 3.6V, bottom boot sector device
= 3.0 - 3.6V. bottom boot sector device
0, 2, 3
0, 1, 3
Packing Type
°
0, 3
C to +85
(Note
(Note
(Note
°
1)
C)
1)
2)
VBK048
SO044
TS048
Package Description
(Note
(Note
(Note
S29AL008D_00A3 June 16, 2005
3)
3)
4)
Fine-Pitch BGA
TSOP
SOP